Hamamatsu-photonics K.k.

Haruyoshi Okada

Kazuki Fujita

Ryuji Kyushima

Junichi Sawada

Minoru Ichikawa

Shuhei Namba

Takao Aritake

Seiji Fukamizu

Harumichi Mori

A radiation imaging device according to one embodiment comprises a radiation detection panel, a base substrate having a support surface configured to support the radiation detection panel, and a housing, wherein: the housing has a top wall and a bottom wall, the base substrate has a protruding portion which protrudes further outward than the radiation detection panel when seen in a direction orthogonal to the support surface, a first extending portion is provided to the support surface of the protruding portion, a second extending portion is provided to a back surface of the protruding portion, the second extending portion being disposed at a position which it faces the first extending portion with the protruding portion interposed therebetween, and the base substrate is supported on the top wall via the first extending portion and is supported on the bottom wall via the second extending portion.

Radiation imaging device

A radiation imaging device according to one embodiment includes a radiation detection panel having a first surface on which a detection region is formed and an electrode pad is formed outside the detection region, and a second surface on a side opposite to the first surface, a base substrate having a support surface configured to face the second surface of the radiation detection panel and configured to support the radiation detection panel, and a flexible circuit substrate connected to the electrode pad via a connecting member, wherein an end portion of the base substrate is located further inward than an inner end portion of the connection region in which the electrode pad, the connecting member, and the flexible circuit substrate overlap each other when seen in an Z direction orthogonal to the support surface.

Radiation imaging device, production method for radiation imaging device, and repair method for radiation imaging device

A radiation imaging device according to one embodiment includes a radiation detection panel having a first surface on which a detection region is formed, and a second surface on a side opposite to the first surface, a base substrate having a support surface configured to face the second surface and configured to support the radiation detection panel, and a flexible circuit substrate connected to the radiation detection panel, wherein an end portion of the base substrate corresponding to a portion to which the flexible circuit substrate is connected is located further inward than an end portion of the radiation detection panel when seen in a first direction orthogonal to the support surface, and the base substrate has a protruding portion which protrudes further outward than the radiation detection panel at a position at which the base substrate does not overlap the flexible circuit substrate when seen in the first direction.

The present embodiment relates to a radiation imaging system and the like provided with a solid-state imaging device having a structure enabling reduction of linear noise appearing in an integrated image. The solid-state imaging device comprises: L pieces of imaging pixel region arranged along a direction crossing a moving direction of a relative position of the solid-state imaging device; and L pieces of A/D converter provided corresponding to the L pieces of imaging pixel region. Each imaging pixel region includes pixels arranged two-dimensionally to form an M-row by N-column matrix. Any one of the L pieces of A/D converter executes a dummy A/D conversion once or more times after an A/D conversion of an electric signal from a pixel of an m-th row, before an A/D conversion of an electric signal from a pixel of an (m+1)-th row.

Solid-state image capturing device, radiation image capturing system, and method of controlling solid-state image capturing device

A solid-state imaging device includes a photodetecting unit including MN pixels arrayed two-dimensionally in M rows and N columns, an output unit outputting a digital value generated on the basis of the amount of charge input from the pixels, and a control unit. The control unit divides the MN pixels in the photodetecting unit into unit regions each including pixels in Q rows and R columns, divides the unit regions arrayed two-dimensionally in (M/Q) rows and (N/R) columns into binning regions each including unit regions in K rows and one column, and repeatedly outputs the digital value according to the sum of amounts of the charges output from KQR pixels included in each binning region from the output unit K times in a column order for each row sequentially for the binning regions arrayed two-dimensionally in (M/KQ) rows and (N/R) columns.

Solid-state imaging device, X-ray imaging system, and solid-state imaging device driving method

A sensor unit includes a metallic base member, a solid-state imaging element, and amplifier chips. The base member has a first placement surface and a second placement surface. The solid-state imaging element has a photodetecting surface, and is disposed on the first placement surface such that a rear surface and the first placement surface face each other. The amplifier chips are mounted on a substrate disposed on the second placement surface. The base member further has side wall portions facing side surfaces of the solid-state imaging element. The chips and the solid-state imaging element are electrically connected to one another via a bonding wire. The chips are thermally coupled to the base member via a thermal via of the substrate.

Growing community of inventors

Hamamatsu, Japan

Haruyoshi Okada