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Denso Corporation

Haruyoshi Kuriyama

Kazukuni Hara

Yoshiaki Fukushima

Kunihiko Hara

Nobuo Kamiya

Hiroyuki Kondo

Shoichi Onda

Naohiro Sugiyama

Toshihiko Tani

Fusao Hirose

Hiroaki Wakayama

Atsuto Okamoto

Shouichi Onda

Takashi Onoda

Takeshi Hasegawa

To produce a SiC crystal in a shape which is used as a wafer, a guide is disposed around a SiC crystal substrate so as to cover a peripheral portion of the SiC crystal substrate. Temperature of the guide may be made higher than the sublimation temperature of the SiC when a SiC crystal is disposed upon and caused to grow on the SiC crystal substrate, thereby controlling and restricting the SiC crystal growth in the direction of the guide. Additionally, when the guide is formed in a substantially hexagonal tube shape, the SiC crystal can be produced in a hexagonal pole shape. In this case, when alignment is made between each diagonal passing through a center of the hexagon shape of the guide and specific direction (<11{overscore (2)}0> or <1{overscore (1)}00> of the SiC crystal substrate), the SiC crystal becomes aligned accordingly.

Method and apparatus for producing silicon carbide crystal

Micropipe defects existing in a silicon carbide single crystal are closed within the single crystal. At least a portion of the micropipe defects opened on the surface of the silicon carbide single crystal (SiC substrate) is sealed up with a coating material. Then heat treatment is performed so as to saturate the inside of the micropipe defects with silicon carbide vapors. By this, the micropipe defects existing in the SiC substrate can be closed within the SiC substrate, not in a newly grown layer. Further, the micropipe defects can be efficiently closed by filling the micropipe defects with a silicon carbide material by preliminarily using super critical fluid and the like.

Method of manufacturing silicon carbide single crystal and silicon carbide single crystal manufactured by the same

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Ama-gun, Japan

Haruyoshi Kuriyama