Adv Antest Corporation

Smk Corporation

Agency of Industrial Science and Technology

Other

Nisshin Flour Milling Co., Ltd.

Aisin Seiki Kabushiki Kaisha

Ministry of International Trade & Industry

National Industrial Research Institute of Nagoya

National Institute of Advanced Industrial Science and Technology

Agency of Industrial Science and Technology Ministry of International

Smk Co., Ltd.

Adramtest Corp.

Reed Co., Ltd

Haruo Yoshida

Shoichi Kume

Yosuke Sakai

Yasuhiro Maeda

Kazutaka Suzuki

Michiaki Endo

Fumio Watanabe

Yuichi Kato

Satoshi Akiyama

Yukiyoshi Yamada

Yoshiaki Hamada

Tadashi Fuyuki

Nobuo Miyamoto

Eisuke Kuroda

Michihide Machida

Kumio Ozeki

Yasuhiro Enya

Yoshinori Nishida

Akinari Ishikawa

Yoshio Tasaki

Takashi Sakurai

Shiro Ikuta

Masamitu Ishikawa

Michio Niwano

Hirokazu Matsumoto

Masayasu Ito

Masataka Nakazawa

Kenichi Kimura

Sota Kawashima

Yoshihide Miyagawa

Shinichi Hasegawa

Yukio Sumita

Tadakatsu Nabeya

Masataka Takehara

Osam Kamishima

Toshinobu Banjyo

Yousuke Sakai

Yoshio Hino

Ryotaro Oishi

Masaru Arai

Tadashi Endo

Yasuhiko Sakamoto

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In a measuring-instrument remote-calibration system and measuring-instrument remote-calibration method, a measuring standard quantity is converted into a parameter adapted for communication, or based on measuring standard quantity, a parameter adapted for communication is generated and sent to a remote place. Alternatively, when the measuring standard quantity is not suitable for communication, it is converted into a form adapted for transportation and the converted measuring standard quantity is sent to a remote place. After the converted measuring standard quantity reaches the place, it is restored to the original measuring standard quantity, thus enabling calibration. The result of the calibration is certified.

Measuring-instrument remote-calibration system and measuring-instrument remote-calibration method

An infrared beam is applied into an infrared transmitting substrate disposed in an environment to be measured; the infrared beam which has undergone multiple internal reflections in the infrared transmitting substrate and exited from the infrared transmitting substrate is detected; the detected infrared beam is spectroscopically analyzed to measure a species and/or a quantity of the substance in the environment present near the infrared transmitting substrate ; and a species and/or a concentration of the substance in the environment to be measured are measured based on the species and/or the quantity of the substance in the environment present near the infrared transmitting substrate . Thus, the substances in the environment, such as organic contaminants, etc., present in the atmosphere can be identified, or their concentrations can be measured, with high sensitivity and realtime.

Method and apparatus for environmental monitoring

The invention allows for testing by high velocity signals of high density LSIs prior to being packaged having an electrode spacing on the odder of 150 &mgr;m, for example. Coaxial transmission lines for termination formed through a terminal support are arranged in a two-dimensional array. Connected to one ends of the transmission lines are one ends of contact pins such as conductive whiskers while the other ends of the transmission lines are connected to a transmission line block of a three-dimensionally upwardly gradually broadening configuration through a connection plate similar in construction to the terminal support The transmission line block holds high frequency transmission lines for relay connected at one ends to the other ends of the coaxial transmission lines and having spacings between the adjacent lines broadened at the other upper ends. The widely spaced upper ends of the transmission lines are connected to a performance board (not shown). The contact pins are about 0.3 to 0.5 mm in length and the characteristics impedance is maintained uniform over all the transmission lines The terminal support is replaceable.

Integrated microcontact pin and method for manufacturing the same

A surface state monitoring apparatus for monitoring a surface state of semiconductor substrates by infrared spectroscopy at fabrication site of semiconductor substrates. The apparatus comprises an incidence optical system for introducing infrared radiation into a substrate-to-be-monitored, a detection optical system for detecting infrared radiation which has undergone multiple reflections inside the substrate and exited from the substrate, a surface state monitoring means for monitoring a surface state of the substrate based on the detected infrared radiation, a position detecting means for optically detecting a position of the substrate, and a control means for controlling a position and an angle at which infrared radiation to be incident on the substrate, corresponding to the position of the substrate.

Surface state monitoring method and apparatus

A substrate treating method and apparatus which can perform in-situ monitoring of surface state of a semiconductor substrate. The substrate treating apparatus comprises substrate treating means for subjecting the substrate to a required treatment, means for condensing infrared radiation emitted by an infrared radiation source onto an outer peripheral part of the substrate and introducing the infrared radiation into the substrate, means for detecting the infrared radiation which has undergone multiple reflection inside the substrate and exited from the substrate, means for analyzing the detected infrared radiation, means for monitoring the surface state of the substrate, and control means for controlling the substrate treating means, based on the monitored surface state of the substrate.

Substrate treating method and apparatus

A surface state monitoring method and apparatus for performing in-situ monitoring of surface states of semiconductor substrates. The apparatus comprises condensing means for condensing infrared radiation to an outer peripheral part of the substrate-to-be-monitored; control means 80 for controlling an incident angle of the infrared radiation condensed by the condensing means ; condensing means for condensing the infrared radiation which has undergone multiple reflection in the substrate-to-be-monitored; detecting means for detecting the infrared radiation condensed by the infrared radiation condensing means , and analyzing means for analyzing the detected infrared radiation detected and measuring contaminants staying on the surfaces of the substrate-to-be-monitored.

Growing community of inventors

Tokyo, Japan

Haruo Yoshida