Hitachi, Ltd.

Nkk Corporation

Nippon Kokan Kabushiki Kaisha

Mitsubishi Jukogyo Kabushiki Kaisha

Isuzu Motors Limited

Central Glass Company, Limited

Haruo Suzuki

Motoyo Wajima

Mineo Kawamoto

Kanji Murakami

Toyofusa Yoshimura

Hiroaki Tsukamoto

Hiroshi Kikuchi

Haruo Akahoshi

Hitoshi Yokono

Hirosada Morishita

Hitoshi Oka

Toshikazu Kawai

Tokio Isogai

Yoshikuni Kadoya

Yutaka Moriya

Toshio Yonezawa

Takemi Yamada

Osamu Miyazawa

Isamu Tanaka

Katsumi Masamura

Shoji Kawakubo

Tomio Yoshida

Masaru Nanba

Akira Matsuo

Sei Murakami

Yoichi Matsuda

Seishi Tsuyama

Masayoshi Kurihara

Tetsuya Sampei

Toshimichi Omori

Makoto Matsunaga

Ryouichi Haga

Koshiro Tsukada

Hiroki Seto

Shouzou Kaneda

Toshio Takano

Moriyasu Nagae

Ryou Morimoto

Toru Inazumi

Nakatsugu Abe

Naotake Ito

Takahiro Kanero

Masayoshi Nakagawa

In the present invention, when an engine of a hybrid vehicle is in a cooled state, a control devicethereof performs control so as to disengage an engine clutchconfigured from a wet multi-disc clutch and supply electrical power to a motor generatorfrom a high-voltage batteryto rotationally drive the motor generatorin order to agitate clutch oilin the engine clutchand raise the temperature thereof.

Hybrid vehicle

A cell culture apparatus is provided which can continuously and accurately measure turbidity of a cell culture solution and culture a cell, without inserting a turbidity sensor from outside into a sterile bag. The cell culture apparatus includes: a flexible and transparent sterile bag that is installed at a prescribed position in the cell culture apparatus and in which a cell contained in a cell culture solution is cultured; and a turbidity sensor that includes a light emitter which emits light to the cell culture solution in the sterile bag via a portion of the sterile bag, a light receiver which receives the light transmitted through the cell culture solution via another portion of the sterile bag, and that is configured to place the light emitter, the portion of the sterile bag, another portion of the sterile bag, and the light receiver, optically on a same straight line.

Cell culture apparatus and cell culture method

Soft magnetic steel material having excellent DC magnetization

Ferrous group shape memory alloys consisting essentially of Cr: 16.0-21.0 wt %, Si: 3.0-7.0 wt % and Ni: 11.0-21.0 wt % and satisfying Ni wt %.gtoreq.[0.67.times.{Cr+1.2.times.(Si+Ti+Zr+Hf+V+Nb+Ta)}-] wt % and (Cr+Si) wt %.gtoreq.20 wt %, these ferrous-group shape-memory alloys having a corrosion resistance, a shape-memorizing properties, an intergranular corrosion resistance and a stress corrosion cracking resistance in nitric acid for nuclear fuel reprocessing plants and high-temperature, high-pressure water for light-water reactors.

Fe-Cr-Ni-Si shape memory alloys with excellent stress corrosion cracking

A chromium heat-resistant steel excellent in toughness and having a high cracking resistance and a high creep strength when said steel is utilized to form a welded joint, said steel consisting essentially of:

Chromoum heat-resistant steel excellent in toughness and having high

A method of manufacturing pressure vessel steel having high strength and high toughness comprising the steps of heating steel to a temperature higher than 1200.degree. C., said steel containing from 0.03 to 0.12 wt. % C, 0.10 to 0.8 wt. % Si, 0.45 to 1.00 wt. % Mn, 0.80 to 3.50 wt. % Cr, 0.10 to 1.60 wt. % Mo, 0.10 to 0.53 wt. % Ni, 0.010 to 0.040 wt. % soluble aluminum, at least one of 0.05 to 0.40 wt. % V and 0.02 to 0.20 wt. % Nb, less than 0.010 wt. % Ti, 0.0002 to 0.0010 wt. % B, and less than 0.004 wt. % N, the balance of iron and impurities, the N and Ti satisfying the following equation

Method of manufacturing pressure vessel steel with high strength and

A printed circuit board comprising an insulating board deposited with a catalyst having reactivity against electroless plating deposition, a resist for electroless plating provided on the insulating board excepting the part where a circuit is to be formed and a circuit formed by electroless plating, wherein the resist for electroless plating contains a coupling agent having a function of preventing the catalyst from ionizing. A process for producing the printed circuit board in which the insulating board surface excepting the part where a circuit is to be formed is covered with a resist for electroless plating containing a coupling agent having a function of preventing the catalyst from ionizing. Use of said resist for electroless plating can prevent drop of insulation resistance of the insulating board after moisture absorption.

Printed circuit board, process for preparing the same and resist ink

A method of efficiently purifying crude 4-fluorophenol containing phenol as impurity. Phthalic acid or its anhydride, or a suitable derivative of phthalic acid, and a dehydrating agent such as sulfuric acid or a metal chloride are mixed with the crude 4-fluorophenol, and the mixture is kept in a liquid state usually with moderate heating to 30.degree.-180.degree. C. until completion of condensation reaction between phenol and the phthal-compound. After that pure 4-fluorophenol can easily be recovered by distillation or recrystallization.

Method of purifying 4-fluorophenol

During recyclic use of a chemical copper plating solution, counter anions to copper ions, anions formed by oxidation of a reducing agent, and carbon dioxide by absorption of carbon dioxide from air, which all have an inhibiting effect upon the plating, and also sodium ions having no inhibiting effect are accumulated in the plating solution. These accumulated ions can be removed by electrodialysis. Particularly, regeneration can be satisfactorily regenerated by adjusting the pH of used chemical plating solution to 2-11 before the electrodialysis, and using a selectively monovalent anion permeable membrane as an anion exchange membrane at the electrodialysis.

Process for regenerating chemical copper plating solution

Printed circuits are produced on an insulating substrate by electroless metal plating according to a method comprising steps of:

Method for production of printed circuits by electroless metal plating

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Tokyo, Japan

Haruo Suzuki