National Institute of Advanced Industrial Science and Technology

Fujikoshi Machinery Corp.

Fujikoshi Kikai Kogyo Kabushiki

Haruo Sumizawa

Yoshio Nakamura

Shiro Hara

Sommawan Khumpuang

Yasuhide Denda

Shinichi Ikeda

Atsushi Kajikura

Satoki Kanda

Fuminari Kotagiri

Daizo Ichikawa

A method of manufacturing semiconductor wafers which facilitates formation of orientation flat lines and allows beveling work without problems. The method of manufacturing semiconductor wafers includes steps wherein a plurality of small-diameter wafers is cut out from a large-diameter semiconductor wafer, the method including: a marking step of forming straight groove-like orientation flat lines by a laser beam so as to cross the respective small-diameter wafers in each row in the large-diameter semiconductor wafer, wherein cutout positions of the small-diameter wafers are aligned in rows in a specific direction, collectively for each of the rows; and a cutting step of cutting out the small-diameter wafers separately from the large-diameter semiconductor wafer, by a laser beam, after the marking step, in such a way that the orientation flat lines are located at required positions in the small-diameter wafers to be obtained.

Method of manufacturing semiconductor wafers

The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier is formed into a thin plate having a through-hole in which a work piece is accommodated. An upper polishing plate polishes an upper face of the work piece. A lower polishing plate pinches the work piece with the upper polishing plate and polishes a lower face of the work piece. A driving mechanism moves the carrier along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece, which has been pinched between the polishing plates, are polished by the polishing plates.

Polishing machine

Growing community of inventors

Nagano, Japan

Haruo Sumizawa