Toyo Boseki Kabushiki Kaisha

Haruo Okudaira

Tsutomu Oko

Masahiro Kobayashi

Keiji Mori

Kunio Takeuchi

Yukinobu Miyazaki

Kazumoto Imai

Akira Matsuda

Yasutomi Yoshino

Fumio Nishimura

Haruhiko Watanabe

Sinitiro Okumura

The present invention provides polyamide layered films suitable for packaging applications, each film having a base layer made of a polyamide polymer and an easy-sliding layer made of a polyamide polymer containing inorganic fine particles at 0.15 to 3.00 wt %, the easy-sliding layer being formed on at least one surface of the base layer, and the first static friction coefficient between the easy-sliding layer side surfaces of the layered films at 23&deg; C. in a 65% RH atmosphere being 0.70 or lower, or the second static friction coefficient between the easy-sliding layer side surfaces of the layered films at 23&deg; C. in a 80% RH atmosphere being 0.95 or lower.

Polyamide layered films

Polyamide laminated film

A process for production of a sheet of a polyamide material which comprises extruding the polyamide material in a melt state in the form of sheet and bringing the extruded sheet in a melt state into contact with the surface of a moving chill body for quenching to give an undrawn film, characterized in that a direct current of high voltage is applied between an electrode and the extruded sheet so as to product a discharge in a streamer corona state onto the extruded sheet, whereby the extruded sheet is brought into tight and close contact with the surface of the moving chill body electrically grounded so as to be chilled quickly.

Electrostatic pinning of extruded polyamide film

Growing community of inventors

Aichi, Japan

Haruo Okudaira