Hitachi Chemical Company, Ltd.

Haruo Ogino

Akishi Nakaso

Hiroyuki Yamaguchi

Seiichi Kurihara

Atsushi Takahashi

Teiichi Inada

Kazunori Yamamoto

Yoshiyuki Tsuru

Shigeharu Arike

Toshiro Okamura

Akinari Kida

Hajime Nakayama

Kazuhisa Otsuka

Hiroharu Kamiyama

Koichi Tsuyama

Yoshihiro Tamura

Yuko Kimura

Tomoko Watanabe

A multilayer wiring plate includes a coaxial wire includes a signal line, an insulation coating and an outer peripheral conductor. An insulating layer is arranged on an inner or outer layer side. A metal film circuit is arranged by the intermediary of the insulating layer, and the metal film circuit and the outer peripheral conductor and signal line of the coaxial wire are connected. A signal line connection part that connects the signal line to the metal film circuit includes a penetration hole A that passes through the insulating layer and the outer peripheral conductor; the coaxial wire from which the outer peripheral conductor is removed inside the penetration hole A; a hole filling resin filled inside the penetration hole A; a penetration hole B that passes through the hole filling resin and the signal line; and a plated layer arranged on an inner wall of the penetration hole B.

Multilayer wiring plate and method for fabricating same

The present invention provides an insulated coated wire comprising a wire, a wire coating layer disposed around the wire, and a wire adhesive layer disposed around the wire coating layer, wherein the wire coating layer is of one type of or a combination of two or more types of a fluorine resin, a polyamide-imide resin and a low dielectric polyimide resin having a relative permittivity of less than 3.6 at 10 GHz, and a multi-wire wiring board using the insulated coated wire.

Insulated coated wire having a wire coating layer of a resin surrounded by a wire adhesive layer of a resin

In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.

Process for producing multilayer printed circuit board

A circuit board having holes (a) and holes (b) therein with different electrically connecting structures and enlarged connecting areas with respect to an insulating substrate and circuit conductors formed on the insulating substrate is excellent in connection reliability and high in wiring density.

Wiring board and process for producing the same

Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after contacting with an aqueous solution of alkali borohydride.

Process for treating copper surface

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Shimodate, Japan

Haruo Ogino