Seiko Epson Corporation

Other

Ricoh Company, Ltd.

Kabushiki Kaisha Suwa Seikosha

Honda Motor Co., Ltd.

Seiko Epson Kabushiki Kaisha

Haruo Nakamura

Minoru Usui

Tomoaki Abe

Haruhiko Koto

Yozo Shimada

Kenji Aoki

Norio Komura

Yasuo Sugimoto

Pierre J Verlinden

Akira Terao

Junichi Ohmura

Katsumori Takei

Mitsuo Nagata

Teiji Miura

Yoshihiro Norikane

Masaru Ohgaki

Yuko Sekiguchi

Yoshikazu Matsushita

Koji Sumi

Hiroshi Miura

Tsutomu Nishiwaki

Toshihisa Saruta

Makoto Matsuzaki

Takanori Tano

Junhua Chang

Norihiko Kurashima

Koei Suzuki

Hong Qiu

Atsushi Onodera

Kenichi Kanbayashi

Shigeru Toda

Go Muto

Hiroshi Umeno

Hiroe Niimura

A liquid droplet ejecting method for ejecting a liquid from at least one ejection hole to form the liquid into liquid droplets, the method including:

Liquid droplet ejecting method, liquid droplet ejection apparatus, inkjet recording apparatus, production method of fine particles, fine particle production apparatus, and toner

A method of manufacturing an interconnection member includes forming on a substrate a wettability changing layer containing a material in which critical surface tension is changed by giving energy; forming a depression part in the wettability changing layer by a laser ablation method using a laser of an ultraviolet region; and coating the depression part with an electrically conductive ink to form an electrically conductive part. At the same time when a pattern of the depression part is formed in the wettability changing layer, a pattern of a high surface energy area is formed as a result of the critical surface tension being changed.

Method of manufacturing interconnection member and electronic device

A liquid droplet ejecting method for ejecting a liquid from at least one ejection hole to form the liquid into liquid droplets, the method including: applying a vibration to the liquid in a liquid column resonance-generating liquid chamber, in which the ejection hole is formed, to form a standing wave through liquid column resonance, and ejecting the liquid from the ejection hole, which is formed in a region corresponding to an antinode of the standing wave, to form the liquid into liquid droplets.

A thermoacoustic engine includes first and second stacks disposed in parallel in a looped tube and a heat storage unit disposed in the looped tube. A circuit length between a center of the first stack and a center of the heat storage unit is equal to a circuit length between a center of the second stack and the center of the heat storage unit. A first acoustic circuit including the first stack and the heat storage unit has a circuit length which is equal to a circuit length of a second acoustic circuit including the second stack and the heat storage unit.

Thermoacoustic engine

A fuel-cell system with a fuel battery comprising more than one fuel cell having a purge gas passage connecting the fuel battery to a purge gas cylinder, a discharge passage connecting the fuel battery to the exterior, solenoid valves each installed in the passages, and an electronic control unit that opens the solenoid valves to open the passages to supply the purge gas to the fuel battery such that residue in the fuel battery is purged to the exterior by the purge gas. The control unit opens the valves at a time interval determined from an output of a current sensor to conduct purge at optimum timing for the battery operating state so as to prevent accumulation of residue in the fuel battery, while preventing repetition of unnecessary purges. Alternatively, manual valves are provided to be manually opened by an operator to open a fuel gas supply passage to supply the fuel gas such that residue is purged by the fuel gas through the discharge passage, thereby enabling fuel supply and purge of residue at starting of power generation, without using an external power source.

Fuel-cell system

A drop-on-demand ink-jet printing head provided with an array of a plurality of piezoelectric elements arranged at regular intervals and fixed at their one ends to a base, the other ends of the respective piezoelectric elements being free ends which are disposed in opposition to nozzle respective apertures, the piezoelectric elements being formed by cutting, at predetermined width, a piezoelectric plate obtained by firing a lamination of paste-like piezoelectric material conductive material stacked alternately in layers. Since each piezoelectric element is composed of a thin piezoelectric plate interposed between electrodes, if a voltage of only about 30 V, which is sufficient to drive the thin piezoelectric plate, is applied across the electrodes, it is possible to largely flex the whole of the piezoelectric element. By this transformation, ink between the top end of the piezoelectric element and the nozzle aperture is discharged to the outside as an ink drop. Because the driving voltage required for forming an ink drop is as low as possible, it is possible to simplify a driving circuit, and because of cutting a piezoelectric plate, it is possible to form small-sized piezoelectric elements with the same accuracy as in a process of producing a semiconductor.

Drop-on-demand ink-jet printing head

A method of fabricating a back surface point contact silicon solar cell having p-doped regions and n-doped regions on the same side by forming a passivating layer on a surface of the cell having opened windows at the p-doped regions and the n-doped regions, by depositing and patterning a first metal layer comprising aluminum on the passivating layer in such a way that the first metal layer comes into contact with the p-doped regions and the n-doped regions, by depositing an insulator layer of inorganic material on the first metal layer, by etching and patterning the insulator layer in such a way that the insulator layer has opened windows at, at least one of the p-doped regions and the n-doped regions, and by depositing a second three-layer metal stack comprising materials other than aluminum, on the insulator layer of polyimide in such a way that the second three-layer metal stack comes into contact with the one of the p-doped regions and the n-doped regions. With this, the cell surface to be soldered onto a metallized substrate is well planarized and even to ensure sufficient conductibility, with less voids and less solder fatigue.

Method of fabricating a silicon solar cell

A piezoelectric actuator, comprising a stacked structure consisting of a top electrode , a piezoelectric film , and a bottom electrode , wherein the piezoelectric film comprises a first group of piezoelectric ceramic particles and a second group of piezoelectric ceramic particles. A distinctive feature is that the particles constituting the first group of piezoelectric ceramic particles are larger than the jingo particles constituting the second group of piezoelectric ceramic particles, and the first group of piezoelectric ceramic particles and the second group of piezoelectric ceramic particles have mutually different compositions. The piezoelectric actuator can thus be manufactured by an application method in a low-temperature environment, and a thicker piezoelectric film can be obtained. In addition, a highly practical piezoelectric film can be provided by combining the advantages of a plurality of material types.

Piezoelectric actuator, ink-jet type recording head, manufacturing method therefor, and ink-jet printer

A method of fabricating a back surface point contact silicon solar cell having p-doped regions and n-doped regions on the same side by forming a passivating layer on a surface of the cell having opened windows at the p-doped regions and the n-doped regions, by depositing and patterning a first metal layer on the passivating layer in such a way that the first metal layer comes into contact with the p-doped regions and the n-doped regions, by depositing an insulator layer of polyimide on the first metal layer, by etching and patterning the insulator layer of polyimide in such a way that the insulator layer has opened windows at, at least one of the p-doped regions and the n-doped regions, by curing the insulator layer of polyimide by heating at temperature for a period, by additionally curing the insulator layer of polyimide by heating at a second temperature, which is higher than the first temperature, and by depositing a second metal layer made of metal stack on the insulator layer of polyimide in such a way that the second metal layer comes into contact with the one of the p-doped regions and the n-doped regions. With this, the cell surface to be soldered onto a metallized substrate is well planarized and even to ensure sufficient conductibility, with less voids and less solder fatigue.

A method of fabricating a back surface point contact silicon solar cell having p-doped regions and n-doped regions on the same side by forming a passivating layer on a surface of the cell having opened windows at the p-doped regions and the n-doped regions, b depositing and patterning a first metal layer on the passivating layer in such a way that the first metal layer comes into contact with the p-doped regions and the n-doped regions, by depositing a first insulator layer of polyimide on the first metal layer, by etching and patterning the first insulator layer of polyimide in such a way that the insulator layer has opened windows at, at least one of the p-doped regions and the n-doped regions, by depositing a second insulator layer of polyimide on the first insulator layer of polyimide, by etching and patterning the second insulator layer of polyimide in such a way that the insulator layer has opened windows at, at least one of the p-doped regions and the n-doped regions, by curing the first insulator layer of polyimide by heating at a predetermined second temperature for a predetermined second time, and by depositing a second metal layer on the second insulator layer of polyimide in such a way that the second metal layer comes into contact with the one of the p-doped regions and the n-doped regions. With this, the cell surface to be soldered onto a metallized substrate is well planarized and even to ensure sufficient conductibility, with less voids and less solder fatigue.

A method of fabricating a back surface point contact silicon solar cell having p-doped regions and n-doped regions on the same side by forming a passivating layer on a surface of the cell having opened windows at the p-doped regions and the n-doped regions, by depositing and patterning a first metal layer on the passivating layer in such a way that the first metal layer comes into contact with the p-doped regions and the n-doped regions, by depositing a first insulator layer of inorganic material on the first metal layer, by etching and patterning the first insulator layer in such a way that the insulator layer has opened windows at, at least one of the p-doped regions and the n-doped regions, by depositing a second insulator layer of organic material on the first insulator layer, by etching and patterning the second insulator layer in such a way that the insulator layer has opened windows at the one of the p-doped regions and the n-doped regions, by curing the second insulator layer by heating at a predetermined temperature for a predetermined time, and depositing a second metal layer on the second insulator layer of organic material in such a way that the second metal layer comes into contact with the one of the p-doped regions and the n-doped regions. With this, the cell surface to be soldered onto a metallized substrate is well planarized and even to ensure sufficient conductibility, with less voids and less solder fatigue.

A drop-on-demand ink-jet printing head provided with an array of a plurality of piezoelectric elements arranged at regular intervals and fixed at their one ends to a base, the other ends of the respective piezoelectric elements being free ends which are disposed in opposition to nozzle respective apertures, the piezoelectric elements being formed by cutting, at predetermined width, a piezoelectric plate obtained by firing a lamination of paste-like piezoelectric material and conductive material stacked alternately in layers. Since each piezoelectric element is composed of a thin piezoelectric plate interposed between electrodes, if a voltage of only about 30 V, which is sufficient to drive the thin piezoelectric plate, is applied across the electrodes, it is possible to largely flex the whole of the piezoelectric element. By this transformation, ink between the top end of the piezoelectric element and the nozzle aperture is discharged to the outside as an ink drop. Because the driving voltage required for forming an ink drop is as low as possible, it is possible to simplify a driving circuit, and because of cutting a piezoelectric plate, it is possible to form small-sized piezoelectric elements with the same accuracy as in a process of producing a semiconductor.

Growing community of inventors

Tokyo, Japan

Haruo Nakamura