Sumitomo Bakelite Company Limited

Haruo Murakami

Michio Kimura

Noriyuki Ohigashi

An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device. These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.

Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device

A resin sheet () is provided with a resin layer (), and a passivation layer () laminated on one surface of the resin layer (). The resin sheet () has a rectangular shape in a plan view. The periphery of the passivation layer () extends outward from the periphery of the resin layer (). The resin layer () is provided with a flat section (), and a slope section () wherein the thickness of the resin layer () gradually reduces toward the outside from the flat section (). A difference between the resin thickness (d) of the boundary section () between the slope section () and the flat section () of the resin layer (), and an average thickness (D) of the flat section () is 5% or less of the average thickness (D).

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Tokyo, Japan

Haruo Murakami