Hitachi Techno Engineering Co., Ltd.

Haruo Mishina

Shinya Yamama

Masato Itagaki

Tomio Yoneda

Shigeru Ishida

Yukio Yamada

Yushi Takahashi

Noriaki Mukai

Satoshi Yawata

Masahumi Wada

Keizo Tsuchiya

Yukihiro Kawasumi

Akimi Miyashita

Mutsumasa Fujii

Kiyoshi Imaizumi

Kiyoshi Imaisumi

Hiroshi Tsutsumi

Masayuki Saito

Mituo Fukuda

Keizo Thuchiya

Masafumi Wada

A paste applicator for drawing a paste film in a desired pattern on a substrate, including a table for detachably supporting a substrate, a paste reservoir tube to be filled with a paste, and a nozzle communicating with the paste reservoir and having a paste discharging port opposing to an upper surface of the substrate mounted on the table. A device is supplied for changing the relative positional relationship between the nozzle and the substrate mounted on the table. The paste is applied onto the substrate to form a desired pattern of the paste. A measuring device measures a position of a paste discharging port of a nozzle exchanged together with the paste reservoir tube by using a paste pattern formed by applying the paste onto the substrate held on the table using the exchanged nozzle. The center of the paste pattern nearly agrees with the center of the paste discharging port. A calculator calculates a positional displacement of the paste discharging port due to the nozzle exchange using the measured result obtained by the measuring device. A positioning device positions the substrate at a desired position with respect to the paste discharging port after nozzle exchange using the result obtained by the calculator.

Paste applicator having positioning means

A heating furnace and a method for uniformly thermo-setting a paste applied onto the surface of a substrate, and for manufacturing a high quality substrate. The heating furnace can be installed in a small area. A plurality of up-and-down moving pins are provided in a furnace body. The plurality of up-and-down moving pins are penetrating a hot plate having a heater and are vertically movable. A substrate loaded through an opening port in an isolation wall is mounted onto the up-and-down moving pins moved in their upper position. The substrate moved down near the hot plate using the up-and-down moving pins is preheated by the heated hot plate. Then, the substrate is further moved down and vacuum attracted to the hot plate to be heated by the hot plate. After that, the substrate is moved up to the original position and nitrogen gas from nozzles of a gas supply pipe is blown on the surface of the substrate to accelerate cooling of the substrate. After being cooled, the substrate is unloaded through the opening port.

Heating furnace

An apparatus for applying a paste to a surface of a substrate by holding the substrate on a table and by moving a nozzle relative to the table to form a desired paste pattern on the substrate. The apparatus has a device for measuring the position of a paste ejection orifice of the nozzle, a processing unit for calculating, from a result of the measurement by the measuring device, a displacement of the position of the paste ejection orifice when the nozzle is changed, and a mechanism for positioning the substrate at a desired position with respect to the ejection orifice of the changed nozzle on the basis of a result of the operation of the processsing unit. With this arrangement, even if the position of the ejection orifice of the nozzle is changed when the nozzle is changed, the desired positional relationship between the nozzle and the substrate can be set with improved accuracy, whereby a paste pattern can be drawn accurately.

Apparatus for applying paste

A hot press used, for example, for producing a thin printed board and a multilayered board, such as liquid crystal glass board bonded by a low-viscosity adhesive, and to a hot press suitable for forming a board requiring uniform bonding pressure. A hot press includes an upper and a lower bolster arranged in vertically opposed relation to each other, an upper and a lower heat plate respectively disposed in opposed relation to the upper and lower bolsters, a device for moving at least one of the upper and lower bolsters toward the other to produce a pressing force between the upper and lower heat plates, and pressure vessels respectively mounted on the heat plates. Each pressure vessel is made of a thin film and is filled with a fluid heating medium. When substrate blanks are interposed between the upper and lower pressure vessels and pressed by them, surface pressure for adhesive bonding becomes uniform, and heat from the heat plates is uniformly transferred to the blanks.

Hot press with pressure vessels to uniformly distribute pressure to the

There is provided a reflow soldering apparatus for soldering electronic parts to a circuit substrate by blowing various inert hot gases of a desired density and temperature. A device for detecting whether or not a processing object is being conveyed into the apparatus is provided, so that the amount of inert gas to be supplied and the gas blowing speed are decreased when no processing object is present inside the apparatus. As a result, the amount of gas which flows out is made small, and a decrease in the temperature of the apparatus can be prevented. When the processing object is conveyed into the apparatus, the amount of supplied gas is increased so as to obtain a sufficient gas density. Thus, it is possible to prevent solder from being oxidized, and satisfactory solderability can be obtained.

Reflow soldering apparatus for soldering electronic parts to circuit

An apparatus for drawing a pattern of a photoresist on a substrate has a nozzle for discharging the paste and a substrate-supporting table movable along the X and Y-axes relative to the paste drawing opening of the nozzle. The nozzle is fixed to a Z-axis table which carries an optical displacement meter which measures the clearance between the substrate and the paste discharging opening. According to the results of the measurements, the Z-axis table is moved toward and away from the substrate so that the clearance is maintained at a desired distance. The optical displacement meter has a measuring point on the substrate. The measuring point is positioned so as not to interfere with the paste line which is drawn on the substrate with paste discharged from the nozzle.

Apparatus for drawing paste pattern on substrate

A paste applicator for drawing a paste pattern on a substrate has X- and Y-axis tables, on which the substrate is mounted, and a paste reservoir tube, a nozzle, a nozzle support and an optical displacement meter all fixed to a Z-axis table in opposite relation to the substrate. The paste reservoir tube and the nozzle are communicated with each other by a horizontal portion of the nozzle support. The horizontal portion is extended to a position below the optical displacement meter so that the nozzle is located close to a measuring point of the optical displacement meter. This arrangement places the nozzle as close as possible to the measuring point of the optical displacement meter, whereby an error between data measured by the optical displacement meter and an actual nozzle-to-substrate gap is substantially eliminated to assure that the paste is applied to the substrate in a desired pattern and configuration.

Paste applicator

A reflow soldering apparatus comprises a preheating chamber and a reflow chamber, both of which are furnished with a plurality of means for circulating a hot gas being composed of a cross flow blower, a divergent nozzle, a heater, a temperature sensor, a temperature controller, and a power regulator etc. The cross-flow blowers above a conveyer are arranged in a back to back manner and the blowers beneath the conveyer are arranged in a face to face manner, and soldering is performed by impinging the hot gas upon a circuit substrate being transferred by the conveyer. A reflow soldering apparatus having a small temperature fluctuation in the preheating chamber and the reflow chamber, high reliability in the soldering by maintaining a desired temperature profile, and preferable economy is provided.

Reflow soldering apparatus

A vapor reflow soldering apparatus includes a unit for delivering an article processed to a vapor generating tank for generating saturated vapor of thermal medium, for allowing the article to be to come in contact with the saturated vapor, and for heating and melting solder of the article. A thermal medium recovery system collects thermal medium which flows in the article delivery path. There is also provided an arrangement for leading at least one part of exhaust gas containing mist from a recovery tank of the thermal medium recovery system for collecting and cooling thermal medium to the outlet-side delivery path for delivering the article. The exhaust gas with mist is blown off to the article being processed. The gas containing the mist is obtained by cooling the thermal medium in vapor phase state. The blown off gas containing mist to increases the cooling speed for the soldered part and the bonding strength, and reduces the consumption of thermal medium.

Vapor reflow soldering apparatus

In a method and a system in which while carrying objects to be treated to a preheating chamber and a reflow chamber adjacent thereto, hot gases are blown against the objects to be treated by cross flow blowers provided in the preheating chamber and the reflow chamber to melt solder so as to solder electronic parts on a circuit substrate; a free air introducing port is controllably provided in the vicinity of an intake port of the cross flow blower in the preheating chamber, and an exhaust port and an exhaust fan for exhausting gases having an amount corresponding to the free air taken from the free air introducing port, out of the preheating chamber are provided.

Reflow soldering method and system therefor

A screen printer which has a cleaning device for cleaning a mask which is formed with at least a hole of a printing pattern. The cleaning device includes a spatula member and an airstream generating device. The spatula member is moved along the surface of the mask in contact therewith so as to scrape ink adhered to the mask surface. The airstream generating device generates an airstream passing through the hole of the mask so as to remove ink within the hole of the mask.

Screen printer

A reflow soldering apparatus having a pre-heating chamber and a reflow chamber, wherein a hot gas recirculation system including a cross-flow blower, a diverging nozzle and a heater is provided in the reflow chamber or both in the pre-heating chamber and the reflow chamber, so that a hot gas such as heated air is uniformly applied to the object such as a combination of a substrate and an electronic parts carried by the substrate, whereby uniform distributions of temperature and flow velocity of the hot gas are attained. The hot gas recirculation means may be arranged so as to vary the angle at which the hot gas impinges upon the substrate and the breadth over which the hot gas is applied.

In case of suspending an apparatus upon the completion of soldering operation, from not smaller than 50% to less than 95% of a thermomedium in a reflow section is transferred to a filtering tank and the remaining thermomedium is made to pass through a water separator in advance of suspending the apparatus, so that water in the thermomedium is removed. This water removing operation makes it possible to prevent the corrosion of the reflow section and the deterioration of the thermomedium. Additionally, a method is disclosed for preventing water to be mixed with the thermomedium by warming the reflow section before operation.

Vapor reflow type soldering method and apparatus therefor

A vapor reflow type soldering apparatus with an upper supply hole of vapor for heating the upper surface of an article to be processed, the position of which is displaced to the downstream side along a direction of delivery with respect to that of a lower supply hole of vapor for heating the lower surface of the article, so that the temperature of the upper surface of the article to be processed can be raised more moderately than that of the lower surface thereof.

Vapor reflow type soldering apparatus

A vapor reflow type soldering apparatus comprises a vapor generating tank disposed substantially centrally in the apparatus for receiving therein a thermal medium and saturated vapor of said thermal medium; a preheating chamber arranged upstream of the vapor generating tank; a cooling chamber arranged downstream of the vapor generating tank; an inlet side passage connecting the vapor generating tank and the preheating chamber; an outlet side passage connecting the vapor generating tank and the cooling chamber; a conveyor extending horizontally through the preheating chamber, the inlet side passage, the vapor generating tank, the outlet side passage and the cooling chamber, wherein the conveyor can vary the width thereof; an outlet side exhaust port provided at the outlet side passage; an inlet side cooler arranged beneath the inlet side passage and having a cover at an upper position thereof; an outlet side cooler arranged beneath the outlet side passage and extending close to the outlet side exhaust port; a lower vapor discharge opening formed below the conveyor within the vapor generating tank; and a shutter connected with a movable conveyor guide and also with the peripheral part of the lower vapor discharge opening, whereby the opening area of said lower vapor discharge opening can be varied as the movable conveyor guide is moved widthwise.

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Ushiku, Japan

Haruo Mishina