Chisso Corporation

Kawasaki Steel Corporation

Haruo Kato

Shizuo Murata

Satoshi Tanioka

Itsuo Shimizu

Kouichi Kunimune

Toshiya Sawai

Kanji Takeda

Seiji Taguchi

Yoshiya Kutsuzawa

Hiroshi Ono

Kumiko Fukui

Hidenori Furukawa

Masami Wada

Akio Takahashi

Kumiko Hara

Toshikazu Nakai

Hidenori Funikawa

Masamitsu Okamoto

Hideaki Shouji

Shigenori Tokunaga

Provided is a varnish composition which can achieve well-balanced electrical characteristics such as a residual charge, a voltage-holding ratio and image sticking and various characteristics such as a pretilt angle, a coating property and an aligning property, which are desired to a liquid crystal alignment film which is prepared therefrom. The above varnish composition comprises a polymer component comprising a polyamide acid represented by Formula (1), a polyamide represented by Formula (2) or the polyamide represented by Formula (2) and a soluble polyimide represented by Formula (3), and a solvent, wherein the above polymer component contains 1 to 60% by weight of the polyamide represented by Formula (2), and the above varnish composition contains 0.1 to 40% by weight of the polymer component:

Varnish composition and liquid-crystal display element

The present invention provides a polyimide alignment film having excellent electrical properties and excellent reliability for use in the field of electronic materials which comprises a polyimide resin produced from a polyamic acid composition comprising a polyamic acid forming a polyimide resin of a low residual voltage and a high voltage holding ratio, and a polyamic acid forming a polyimide resin of a large pre-tilt angle, blended them in the ratio of the former to the latter of 50/50 to 95/5 (weight ratio), a polyamic acid composition for providing such a polyimide aligning film and a liquid crystal display element produced from such an aligning film.

Polyamic acid composition, liquid crystal aligning film, and liquid crystal display element

Composition for liquid crystal aligning film, liquid crystal aligning

A process for producing a film carrier having a superior lead strength, which comprises removing from a film carrier body of a two-layer structure consisting of a metal conductor layer and an organic resin insulating layer snch as a polyimide resin layer, a definite portion of the organic resin insulating layer, or alternatively removing from a film carrier body of a three-layer structure consisting of a metal conductor layer, an organic resin insulating layer and an adhesive layer therebetween, definite portions of the organic resin insulating layer and the adhesive layer, by means of a cutting machine, to form an opening part, and also cutting a portion of the metal conductor layer under the opening part, to reduce the thickness of the metal conductor layer.

Process for producing a film carrier having a superior lead strength

A process for producing a cheap carrier tape of a two layer structure having a superior heat resistance, difficultly susceptible of effect of impurities and having a superior flexibility is provided, which process comprising the following steps: coating a polyimide varnish onto a continuous, electrically-conductive metal foil and baking it; punching the resulting tape of a two layer structure of the metal foil and the polyimide film to form sprocket holes; cutting and removing the polyimide film to form a device hole; coating a resist onto the metal foil surface; light-exposing the resulting resist by the medium of a mask for separating a circuit pattern and a circuit from the sprocket parts; developing the resulting resist and etching the metal foil by the medium of a mask of the resist; removing the resist; and plating the metal foil.

Process for producing a carrier tape

The present invention intends to provide a cured material of a silicon-containing polyimide having high heat resistance, low coefficient of thermal expansion, no brittleness and high hardness. In order to enable liquid coating and impregnation, a silicon-containing soluble polyimide precursor is first prepared. The precursor may be prepared by mixing five compounds of ##STR1## (R.sup.1 is a tetravalent carbon cyclic aromatic group), NH.sub.2 --R.sup.2 --NH.sub.2 (R.sup.2 is an aliphatic group, an alicyclic group, an aromatic aliphatic group or a carbon cyclic aromatic group, a polysiloxane group or 1,3,5-triazine group having a substituent), NH.sub.2 --R.sup.3 --SiR.sup.4.sub.3-k X.sup.1.sub.k and NH.sub.2 --R.sup.3 --SiR.sub.3-m.sup.4 X.sup.1.sub.m (R.sup.3 is --(CH.sub.2).sub.s --, ##STR2## wherein s is an integer of 1 to 4, and R.sup.4 is an alkyl group, a phenyl group or an alkyl-substituted phenyl group and SiX.sub.4.sup.2, X.sup.1 and X.sup.2 are independently an alkoxy group, an acetoxy group, a halogen or a hydroxyl group), and then heating the mixture. Coating or impregnation of this precursor is then given and afterward heated at a temperature of 50.degree. to 500.degree. C., thereby obtaining the cured material of the silicon-containing polyimide.

Silicon-containing soluble polyimide precursor, its cured material, and

A method and a device for monitoring combustion conditions in a metallurgical furnace which is effective and simple in structure and can provide a wide monitoring range of high accuracy. The combustion conditions in the furnace are monitored by a probe lying oblique to the axis of the blow pipe. Toward this end, the probe is inserted into the furnace through a tuyere. The tuyere has a through opening admitting the probe and allows the probe in an orientation oblique to the radii of the blow pipe.

Method and device for monitoring combustion in furnace

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Chiba, Japan

Haruo Kato