Tokyo Electron Limited

Tokyo Electron Kabushiki Kaisha

Kumamoto University

Tokyo Electron Kyushu Limited

Haruo Iwatsu

Toshiyuki Matsumoto

Masami Akimoto

Akihiro Fujimoto

Tomohisa Hoshino

Yasuhiro Sakamoto

Hidenori Akiyama

Junro Iwakiri

A substrate processing method of performing a predetermined processing by supplying a processing liquid to a processing region of a substrate and using processing target ions in the processing liquid, includes: arranging a template to face the substrate, the template including a passage configured to distribute the processing liquid, a direct electrode, and an indirect electrode, and the substrate including a counter electrode, which matches with the direct electrode, installed in the processing region; supplying the processing liquid to the processing region through the passage; and performing the predetermined processing on the substrate by applying a voltage to the indirect electrode to cause the processing target ions to migrate to the counter electrode side while applying a voltage between the direct electrode and the counter electrode to oxidize or reduce the processing target ions that have migrated to the counter electrode side.

Substrate processing method and template

An electrolytic treatment device that performs a prescribed treatment using ions to be treated that are contained in a treatment liquid, and includes a direct electrode and a counter electrode which are arranged on either side of the treatment liquid, an indirect electrode which forms an electric field in the treatment liquid, and a switch which switches between connection of the indirect electrode to the power source and connection of the indirect electrode to the direct electrode or the counter electrode. The switch connects and applies a voltage across the indirect electrode and the power source, and breaks the connection between the indirect electrode and the power source and connects the indirect electrode to the direct electrode or the counter electrode.

Electric field treatment method and electric field treatment device

An electrolytic treatment method in which a predetermined treatment is performed using treatment subject ions contained in a treatment liquid, the method including: an electrode positioning step for positioning a direct electrode and a counter electrode so as to sandwich the treatment liquid, and positioning an indirect electrode for forming an electric field in the treatment liquid; a treatment subject ion migration step for applying a voltage to the indirect electrode and thereby moving the treatment subject ions in the treatment liquid to the counter electrode side; and a treatment subject ion redox step for applying a voltage between the direct electrode and the counter electrode and thereby oxidizing or reducing the treatment subject ions which have migrated to the counter electrode side.

Electrolytic treatment method and electrolytic treatment apparatus

A method for manufacturing a semiconductor device includes: forming a structure including a substrate, a device layer formed on the substrate, a pair of through-hole electrodes penetrating through the substrate in the thickness direction of the substrate, a pair of vertical electrodes extending in the thickness direction of the substrate and reaching to one surface of the substrate, and a shared wiring connecting the pair of vertical electrodes in the device layer; forming a connection wiring connecting one of the through-hole electrodes and one of the vertical electrodes; and stacking the structure and a second substrate such that an electrode of the second substrate is connected to a through-hole electrode which is not connected to the connection wiring among the pair of through-hole electrodes.

Method for manufacturing semiconductor device, semiconductor device and jig for forming wiring

A method of manufacturing a semiconductor device, wherein a first substrate where first electrode pads are formed and a second substrate where second electrode pads are formed are stacked and the first electrode pads and the corresponding second electrode pads are electrically connected thereby forming the semiconductor device is disclosed. The method includes steps of performing a first hydrophilic treatment with respect to the first electrode pads; supplying liquid to a surface where the first electrode pads are formed in the first substrate; and placing the second substrate on the first substrate to which the liquid is supplied so that the surface where the first electrode pads are formed opposes a surface where the second electrode pads are formed, thereby aligning the first electrode pads and the second electrode pads by the liquid that gathers in the first electrode pads that have been subject to the first hydrophilic treatment.

Method of manufacturing semiconductor device

When a glass substrate is conveyed from a processing device group side to an accommodating apparatus, the glass substrate is accommodated to a first accommodating portion corresponding to the layer formed on the glass substrate. When a predetermined number of glass substrates have been accommodated to each accommodating portion, glass substrats accommodated in each accommodating portion corresponding to the layer of the glass substrates are conveyed to an exposing device side. After the exposing device has performed an exposing process for glass substrates, they are successively accommodated to the relevant accommodating portion. In the order of which glass substrates have been conveyed from the processing device group side to the accommodating apparatus, the glass substrates are returned to the processing device side.

Accommodating apparatus and substrate processing system

A coating apparatus includes a rotating and holding mechanism which holds and rotates an object to be coated, a container which encloses the rotating and holding mechanism and prevents the dispersion of coating liquid supplied to the object, a washing fitting provided to the rotating and holding mechanism and which supplies washing liquid for washing off coating liquid which has attached to the inside of container. This washing fitting has a collection pool for collecting the washing liquid, and discharge holes through which the washing liquid in the collection pool is discharged by rotation of the rotating and holding mechanism. Thus, it is possible to evenly wash off coating liquid which has attached to the inside of the container in a short time with a small amount of washing liquid.

Coating apparatus

A liquid coating device for coating a solution on a substrate to form a film includes a chuck for rotatably supporting the substrate, a nozzle for supplying the solution on the substrate, a heater provided in the nozzle for changing a temperature of the solution, a sensor for measuring a temperature of an ambient atmosphere of the substrate, and a controller for controlling the heater according the measured temperature. Thus, a solution having a temperature corresponding to the temperature of the ambient atmosphere is supplied from the nozzle to the substrate.

Growing community of inventors

Kumamoto, Japan

Haruo Iwatsu