Ebara Corporation

Kabushiki Kaisha Toshiba

Other

Harumitsu Saito

Tetsuji Togawa

Manabu Tsujimura

Atsushi Shigeta

Hiromi Yajima

Toyomi Nishi

Shoichi Kodama

Riichiro Aoki

Shiro Mishima

Gisuke Kouno

Yukio Imoto

Kazuaki Himukai

Masako Watase

Takahiro Ohshita

Hideo Ishihara

Yasuhiro Niimura

A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

Polishing apparatus

Polishing apparatus and a method of polishing and cleaning and drying a wafer

Polishing apparatus and method

Polishing aparatus and method

A multistage vacuum pump including a plural set of two lobe type vacuum pumps arranged on a common shaft for rotors and in a common casing. The adjacent pumps are connected in series with each other through a communicating passage formed in a pump casing. A solid material collector having a cooling device is provided in the communicating passage so that it is dismountable from the pump casing. A solid component in a compressed gas is forcibly produced by and adhered to the solid material collector. Thus, it is not necessary to disassemble the pump casing for cleaning the same.

Multistage vacuum pump with interstage solid material collector and

A method for incinerating material is disclosed wherein a vertical thermal reactor of the fluidized bed type is employed, the reactor being generally a rectangular shape in a horizontal section and having opposed side walls. Fluidizing medium is subjected to different mass flow at the center portion and the side portions so that relatively strong side fluidized beds are formed adjacent the side walls and a relatively weak fluidized bed is formed at the center sandwiched by the side fluidized beds free of any obstructions therebetween. The center fluidized bed tends to descend relative to the side fluidized beds which are deflected at the upper portions thereof, respectively toward the center so that the fluidized medium circulates from the lower part of the center fluidized bed to the lower parts of the side fluidized beds and from the upper parts of the side fluidized beds towards the upper part of the center fluidized bed. The material to be thermally processed is charged to the upper part of the center fluidized bed and pre-shredding of the material is not required.

Method for incinerating material

A fluidized bed type thermal reactor having a furnace housing wherein there is substantially no partition wall and adapted to generate a downwardly descending moving bed portion and whirling fluidized bed portions at opposite lateral sides of the moving bed, respectively, whereby pre-shredding or crushing of material to be charged into the furnace is made substantially unnecessary. The reactor is provided with a unique feeder for charging the material so that the incombustible items the size of which is not suitable to be charged into the furnace are rejected by reversing the feeding direction of the feeder when the presence of such items is sensed.

Thermal reactor of fluidizing bed type

Growing community of inventors

Yokohama, Japan

Harumitsu Saito