Tohoku University

Haruko Yamazaki

Akihisa Inoue

Nobuyuki Nishiyama

Disclosed is a beryllium-free copper alloy having high strength, high electric conductivity and good bending workability and a method of manufacturing the copper alloy. Provided is a copper alloy having a composition represented by the composition formula by atom %: Cu100-a-b-c(Zr, Hf)a(Cr, Ni, Mn, Ta)b(Ti, Al)c [wherein 2.5&#x2266;a&#x2266;4.0, 0.1&#x3c;b&#x2266;1.5 and 0&#x2266;c&#x2266;0.2; (Zr, Hf) means one or both of Zr and Hf; (Cr, Ni, Mn, Ta) means one or more of Cr, Ni, Mn and Ta; and (Ti, Al) means one or both of Ti and Al], and having Cu primary phases in which the mean secondary dendrite arm spacing is 2 &#x3bc;m or less and eutectic matrices in which the lamellar spacing between a metastable Cu5(Zr, Hf) compound phase and a Cu phase is 0.2 &#x3bc;m or less.

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Sendai, Japan

Haruko Yamazaki