Adv Antest Corporation

Haruki Nakajima

Hiroyuki Kikuchi

Tsuyoshi Yamashita

Noriyuki Igarashi

Toshio Kashiwazaki

Hiroshi Okuda

Toshiyuki Kiyokawa

Noboru Masuda

Tadashi Kainuma

Yuichi Nansai

Norivuki Igarashi

There is provided an electronic device transfer apparatus which has an excellent capacity of transferring DUTs between trays. An electronic device transfer apparatus, which transfers DUTs between trays, includes a device conveying unit. The device conveying unit includes a plurality of shuttles which hold the DUTs, an endless first guide rail which guides the shuttles, and first to third feeders which move the shuttles on the first guide rail. The shuttles are movable on the first guide rail over the entire circumference of the rail.

Electronic component transfer shuttle

Electronic device transfer apparatus, electronic device handling apparatus, and electronic device testing apparatus

There is provided a pitch changing apparatus which can change a pitch of DUTs when the DUTs are transferred between trays by a shuttle revolving system. The pitch changing apparatus, which changes the pitch of DUTs, includes a plurality of shuttles which hold DUTs, a first guide rail which guides the plurality of shuttles, a second feeder which feeds the shuttles along the first guide rail at a first pitch, a third feeder which includes a plurality of pins receiving the shuttles from the second feeder and moves the pins along the first guide rail at a second pitch, and a controller which controls a feed rate of the second feeder and a receiving rate of the third feeder.

Pitch changing apparatus, electronic device handling apparatus, and electronic device testing apparatus

A holding side contact arm () for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera () of an alignment device (), the IC to be tested is inserted to a first opening () formed on an alignment movable portion (), and a contact member () of the holding side contact arm () is brought to contact the alignment movable portion (). Then, an alignment amount for correcting a position of the IC to be tested is calculated by taking an image by the camera () and performing image processing. A lock-and-free means () provided to a first contact arm () is made to be in a non-restricted state, a movable portion driving device () is driven based on the alignment amount, and the holding side contact arm () contacting the alignment movable portion () is moved with respect to a root side contact arm (), so that alignment of a position of the IC to be tested is performed.

Electronic part test apparatus

A device holding apparatus comprising a base plate; a hollow pad guard provided on the base plate; a pad pin inserted to the pad guard movably in an axis direction and having a through hole; a pad provided at a tip of the pad pin and having a through hole connected to the through hole of the pad pin; and a bellows pad provided on the base plate, having a through hole connected to the through hole of the pad pin and being elastic in the axis direction; for holding by suction a device by the pad by applying a negative pressure to the through hole of the bellows pad, the through hole of the pad pin and the through hole of the pad.

Holding apparatus

An IC testing apparatus,for performing a test by applying at least a low temperature stress to ICs to be tested comprising a refrigerant cycle,wherein at least a compressor,, condenser,, expansion valve,and evaporator,are connected in this order, and a cold air applying line,having a blower,for supplying heat exchanged cold air by the evaporator,to the ICs to be tested.

Growing community of inventors

Tokyo, Japan

Haruki Nakajima