Shipley Company LLC

Haruki Enomoto

Motoya Shimazu

Makoto Kondo

Michael P Toben

James L Martin

Yasuo Ohta

Yasushi Takizawa

Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 4 to 9, and a ratio of nickel ions to chloride ions of 1 or less.

Nickel electroplating solution

Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 5 to 7, and a ratio of nickel ions to chloride ions of greater than 1.

Electrolyte compositions useful for forming gold coatings on nickel containing substrates are disclosed. Also disclosed are methods of plating gold layers on nickel containing substrates.

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Hasuda, Japan

Haruki Enomoto