Kabushiki Kaisha Toshiba

Haruka Yamamoto

Tamio Ikehashi

Takashi Ito

Yasushi Tomizawa

Keiichiro Matsuo

Masatoshi Tanabe

Takahiro Aizawa

Izuru Komatsu

Jun Karasawa

Shinya Hayashiyama

A power module includes a base plate, a casing, a substrate unit, a terminal plate, a first resin layer, and a second resin layer. The substrate unit includes a substrate fixed on the base plate, a dam part, a semiconductor chip, a metal member, and a wire. The dam part is formed along an edge of the substrate. The wire includes an electrode plate connection portion, and a chip connection portion. The first resin layer is located inward of the dam part. The chip connection portion and the electrode plate connection portion are located inside the first resin layer. The second resin layer is located on the first resin layer. The upper surface of the metal member is located inside the second resin layer. An elastic modulus of the second resin layer is less than that of the first resin layer.

Power module

A power module includes: a base plate having a first surface; electrode plate provided at the first surface; a wire connected to a semiconductor chip and the electrode plate; a metal member connected to the electrode plate; a terminal plate; a first resin layer, a connection portion of the wire and the semiconductor chip being disposed inside the first resin layer; and a second resin layer provided on the first resin layer and having a lower elastic modulus than the first resin layer. The terminal plate includes a bonding portion contacting an upper surface of the metal member, a curved portion curved upward from the bonding portion. The curved portion is disposed inside the second resin layer, and a length from the first surface of a lower surface of the bonding portion is greater than a length from the first surface of the connection portion.

An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.

Ultrasonic bonding apparatus, control device and control method

An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.

Ultrasonic bonding apparatus

An angular velocity acquisition device includes a movable body, a drive electrode to which a drive voltage is applied to vibrate the movable body in a first direction, at least one stopper that stops the movable body at a predetermined position, a hold electrode which receives a hold voltage to hold the movable body at the predetermined position, a detection unit that detects a predetermined physical quantity depending on an amplitude of the vibration of the movable body in a second direction based on a Coriolis force acting on the movable body that vibrates in the first direction, and an angular velocity calculation unit that calculates an angular velocity of the movable body based on the predetermined physical quantity detected by the detection unit.

Angular velocity acquisition device and electronic component for acquiring angular velocity

According to one embodiment, an angular velocity acquisition device includes a movable body that vibrates in a first direction and in a second direction that is based on Coriolis force and includes a movable electrode portion extending in the second direction, a hold electrode that extends in the second direction and includes a fixed electrode portion opposite to the movable electrode portion across a gap, and a stopper that is provided between the fixed electrode portion and the movable electrode portion and includes an end portion closer to the movable electrode portion than a surface of the fixed electrode portion facing the movable electrode portion.

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Yokohama, Japan

Haruka Yamamoto