Hitachi, Ltd.

Haruhisa Sakamoto

Mikio Hongo

Kaoru Katayama

Tateoki Miyauchi

Shigenobu Maruyama

Chie Shishido

Hiroshi Fukuda

Ryohei Satoh

Shinichi Kazui

Kazuo Mera

Yukio Matsuyama

Kiyoshi Matsui

Minoru Suzuki

Koyo Morita

Katsurou Mizukoshi

Hiroya Hoshishiba

A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of completely modifying an open pattern defect of the conductive lines or an insulator layer, and its device, wherein a first energy beam is irradiated to portions of repair terminals 9 and 9' which are intended to connect or disconnect, of conductive lines 5 and 5' in the electronic circuit board thereby removing a protection layer, making windows and exposing the terminals 9 and 9' for connection; a second energy beam is irradiated thereby disconnecting the repair terminals 9 and 9', or a metal piece for connecting is supplied to between the repair terminals 9 and 9' and applying an energy thereto thereby electrically connecting them; and the disconnected or connected windowed portion is locally coated with the insulator layer thereby modifying the conductive lines of the electronic circuit board. Further, windows 311 or 311' is formed in an insulating protection layer 310 on a conductive line connecting portion 308 formed in a couple or a conductive line disconnecting portion 309, a conductive line of the conductive line disconnecting portion is disconnected or a liquid material 312 for connecting conductive lines is supplied to the conductive line connecting portion 308, a metal layer 313 is precipitated by heating the liquid material 312 thereby connecting the conductive line connecting portion 308, and the window 311 or 311' is coated with an organic insulator layer.

Method of modifying conductive lines of an electronic circuit board and

The present invention relates to a method for producing a thin film substrate for forming a thin film circuit pattern on a substrate by repeating the lithography process using a photoresist and provides a method for producing a thin film having a high yield by preventing accumulation of faults at the time of thin film forming with high reliability and executing the inspection and repair process efficiently using the characteristics of the condition of generated faults. The method is constructed so as to inspect a resist pattern without exposure to light before etching the base layer in the inspection process of the lithography process using a photoresist, to particularly repair a lacking-fault part among detected fault parts, to execute inspection for an etching remnant in the thin metal film inspection and repair process after the etching ends, and to remove and repair etching remnants, if any.

Method for producing thin-film substrate

A laser machining apparatus includes a laser beam source, such as of excimer laser, which produces a laser beam to be projected on a work piece or a sample, first and second illumination light sources which have wavelengths substantially equal to the wavelength of the laser beam and illuminate the entire image and the laser beam, respectively, a first beam splitter which guides the image produced by the illumination light to an observation unit, a second beam splitter which guides the laser beam from the laser beam source to an objective lens, and a controller which controls the machining condition including the relative positioning between the sample and the laser beam depending on the result of observation. The laser beam guide path structure from the laser beam source to the sample has its interior wall made of laser-transparent material such as glass, and the transparent material is enclosed by a laser blocking material such as a metal or water.

Laser machining apparatus and method of the same

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Yokohama, Japan

Haruhisa Sakamoto