Denso Corporation

Haruhisa Koike

Hironobu Baba

Yukihiro Kato

Hiroshi Nomura

Toshihiko Takahata

Takashige Saito

Masahiro Honda

Nobuo Segawa

Shinpei Taga

In manufacturing a sensor device, a sensor chip having a sensing portion on a surface thereof is mounted on one surface of a substrate, and a resin having a volatile property is arranged on the surface of the sensor chip, thereby covering the surface of the sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member. After that, the sealing member is cured, and the resin is heated to be vaporized so that a void is formed between a covered portion in the surface of the sensor chip, which is covered by the sealing member, and the sealing member.

Sensor device and manufacturing method thereof

A pressure sensor includes a case having a concave portion, a sensing portion disposed in the concave portion to output an electrical signal proportional to an applied pressure, a circuit portion disposed in the concave portion and connected to the sensing portion and a conductive diaphragm fixed to the case to cover the concave portion. A conductive member surrounds the sensing portion and the circuit portion to provide an electrical shield. The diaphragm is used as a part of the conductive member.

Electrical shield structure for pressure sensor

A pressure sensor includes a sensor device and a diaphragm. The diaphragm is exposed to a fluid, a pressure relative to which is detected using the sensor device. The diaphragm is made of a material having a pitting index, which is defined by the equation, (Cr&plus;3.3Mo&plus;20N), of 50 or greater and Ni content of 30 weight % or greater to prevent the diaphragm from corroding due to the fluid.

Pressure sensor with a corrosion-resistant diaphragm

Growing community of inventors

Kariya, Japan

Haruhisa Koike