Sony Semiconductor Solutions Corporation

Sony Corporation

Haruhiko Terada

Yotaro Mori

Makoto Kitagawa

Yoshiyuki Shibahara

Keiichi Tsutsui

Hideaki Okubo

Lui Sakai

Riichi Nishino

Tetsuya Yamamoto

Yasushi Fujinami

Kenichi Nakanishi

Ken Ishii

Naohiro Adachi

Tsunenori Shiimoto

Tatsuo Shinbashi

Jun Okuno

Hiroyuki Iwaki

Kohei Homma

Matatoshi Honjo

A semiconductor device according to an embodiment of the present disclosure includes: a memory cell array including a plurality of first selection lines extending in a first direction, a plurality of second selection lines extending in a second direction, and a plurality of memory cells each provided between the plurality of first selection lines and the plurality of second selection lines; a voltage generator that is configured to generate a selection voltage to be applied to one of the plurality of first selection lines; and a decoder section that includes a plurality of selection transistors and a gate driving section, and selects one of the plurality of first selection lines and applies the selection voltage to the selected first selection line, the plurality of selection transistors each provided in a plurality of selection paths coupling the plurality of first selection lines and the voltage generator, the gate driving section that drives gates of the plurality of transistors and is configured to apply a first driving voltage to the gates of the plurality of transistors, the first driving voltage being a positive voltage exceeding a withstand voltage of the plurality of selection transistors.

Semiconductor device and method of controlling the same

Provided is a memory access control unit that performs writing by dividing write data and an error correction code thereof into a plurality of memories, and acquires presence or absence of occurrence of a verify error in each of the plurality of memories related to the writing. In a case where the verify errors occur in at least any of the plurality of memories, an error bit length acquisition unit acquires bit lengths of the verify errors from the plurality of memories and a write control unit determines that the writing has succeeded if a total bit length of the verify errors falls within a range of a capability allocated to an error bit length tolerance of the error correction code, and determines that the writing has failed if the total bit length of the verify errors falls outside the range.

Memory control circuit, memory, and memory module

Provided is a memory module which includes a controller which, upon reception of a read command including a logical address, converts the logical address included in the read command into a physical address using address lookup information. The controller further inputs a first physical address, which is a portion of the physical address obtained by the conversion, to a non-volatile memory via a first address bus terminal, and then inputs a second physical address, which is a rest of the physical address obtained by the conversion, to the non-volatile memory via a second address bus terminal, to thereby read data corresponding to the physical address obtained by the conversion from the non-volatile memory.

Memory module

Reliability of stored data is improved without increasing power consumption in a case where a threshold of a control element in a memory cell changes. In a memory including the memory cell, a reference cell, and an access control unit, the memory cell changes from a non-conduction state to a conduction state according to an applied voltage at a threshold voltage and changes to a high resistance state and a low resistance state according to the voltage applied in the conduction state. The reference cell changes from a non-conduction state to a conduction state at a reference threshold voltage according to an applied voltage. The access control unit estimates that the reference threshold voltage measured in the reference cell is the threshold voltage of the memory cell and applies a voltage to the memory cell when accessing the memory cell.

Memory, information processing system, and method of controlling memory

A semiconductor device includes a plurality of first selection lines extending in a first direction and disposed side by side in a second direction, the second direction intersecting with the first direction, a first metal wiring line formed in a layer above the first selection line layer, a first through wiring line penetrating an insulating layer formed on the first selection line layer, and coupling a first line of the plurality of first selection lines and the first metal wiring line to each other, a second through wiring line penetrating the first selection line layer, the second through wiring line having one end coupled to the first metal wiring line, a first storage element having a first terminal, and a second terminal coupled to the first line, and a first drive circuit coupled to another end of the second through wiring line, and drives the plurality of first selection lines.

Wiring line layout in a semiconductor memory device

Provided is a memory device that has a structure suitable for still higher integration while securing production easiness, and includes n memory cell units stacked, on a substrate, in order as first to n-th memory cell units in a first direction. The n memory cell units each include: one or more first electrodes; a plurality of second electrodes each provided to intersect the first electrode; a plurality of memory cells provided at respective intersections of the first electrode and the second electrodes and each coupled to both the first and second electrodes; and one or more lead lines coupled to the first electrode to form one or more coupling parts, which, in (m+1)-th memory cell unit, are located at a position where the coupling parts and m-th memory cell region surrounded by the memory cells in m-th memory cell unit overlap each other in the first direction.

Memory device and memory system

A memory apparatus includes a memory cell disposed at an intersection of a first wiring line and a second wiring line, and including a variable resistor and a selector, the variable resistor having a resistance state that changes to a first resistance state and a second resistance state, and a drive circuit that writes data to the memory cell by changing the variable resistor from the first resistance state to the second resistance state, and erases the data stored in the memory cell by changing the variable resistor from the second resistance state to the first resistance state. When erasing the data, the drive circuit changing in a stepwise manner a voltage applied to the memory cell, and changing in a stepwise manner a current limit value that limits a magnitude of a current flowing through the memory cell.

Memory apparatus and method of controlling memory apparatus

In a memory unit according to an embodiment of the present disclosure, a memory cell array is configured, when, of a plurality of memory cells, multiple first memory cells whose corresponding fourth wiring line and first wiring line are different from one another are simultaneously accessed, to allow for simultaneous access to the multiple first memory cells, without allowing for simultaneous access to memory cells corresponding to the fourth wiring line shared by the first memory cells.

Memory unit

A storage device according to the present disclosure includes: a plurality of first wiring lines extending in a first direction and including a plurality of first selection lines and a plurality of second selection lines; a plurality of second wiring lines extending in a second direction and including a plurality of third selection lines and a plurality of fourth selection lines, the second direction intersecting the first direction; a plurality of first memory cells; a first driver including a first selection line driver that drives the plurality of first selection lines on a basis of a first selection control signal and a second selection line driver that drives the plurality of second selection lines on a basis of the first selection control signal, the first and second selection line drivers being arranged side-by-side in the first direction; and a second driver including a third selection line driver that drives the plurality of third selection lines on a basis of a second selection control signal and a fourth selection line driver that drives the plurality of fourth selection lines on a basis of the second selection control signal, the third and fourth selection line drivers being arranged side-by-side in the second direction.

Storage device for storing data using a resistive random access storage element

Provided is a storage device that includes a plurality of first wiring lines including a plurality of first and second selection lines, a plurality of second wiring lines including a plurality of third and fourth selection lines, a first selection line driver that applies a first voltage and a second voltage to one or more selection lines of the plurality of first and second selection lines respectively, the first voltage and the second voltage being one of a first and a second selection voltage, and the first and the second voltage are different, and a second selection line driver that applies a third voltage and a fourth voltage to one or more selection lines of the plurality of third and fourth selection lines respectively, the third voltage and the fourth voltage being one of the first and the second selection voltage, and the third and the fourth voltage being different.

Storage device and control method for controlling operations of the storage device

The semiconductor device of the present disclosure includes a plurality of first selection lines provided in a first region, extending in a first direction, and aligned in a second direction; a plurality of second selection lines provided in a second region having a portion that overlaps a portion of the first region, extending in the second direction, and aligned in the first direction; a plurality of third selection lines provided in a third region having a portion that overlaps a portion of the second region, extending in the first direction, and aligned in the second direction; a plurality of fourth selection lines provided in a fourth region having one portion that overlaps a portion of the first region and having another portion that overlaps a portion of the third region, extending in the second direction, and aligned in the first direction; a first coupling part, a first coupling part, a first coupling part, and a first coupling part coupled, respectively, to the plurality of first selection lines, the plurality of second selection lines, the plurality of third selection lines, and the plurality of fourth selection lines; a driver; and memory cells.

Semiconductor device

Provided is an initialization control unit that causes a resistance value of a variable resistive element in an access restriction region to be changed to an initial value larger than a predetermined value. The resistance value is changed in a read only mode among the read only mode in which writing to the access restriction region is prohibited and a writable mode in which the writing to the access restriction region is permitted. The access restriction region is in a memory cell array in which the variable resistive elements are arranged, and the initialization control unit transitions to the writable mode. In addition, a write control unit causes a resistance value of an element corresponding to write data among the variable resistive elements in the access restriction region to be changed to a value smaller than the initial value in the writable mode, and transitions to the read only mode.

Memory controller and memory system for suppression of fluctuation of voltage drop

To suppress an increase in a voltage drop in a non-volatile memory including a variable resistive element installed therein. A memory controller includes a voltage drop amount estimating unit and an encoding unit. The voltage drop amount estimating unit estimates a voltage drop amount from a wiring resistance of a wiring up to a memory cell and a leakage current occurring in the memory cell when original data is caused to be held in the memory cell. The encoding unit performs a predetermined encoding process on the original data in a case in which the estimated voltage drop amount exceeds a predetermined threshold value.

Memory controller, non-volatile memory, and method of controlling memory controller

Detecting a defective cell in a memory in consideration of an error property difference depending on the storage state. A determination unit determines whether there is a possibility of defect for each of unit-of-storages on a memory cell formed with a non-volatile memory. The non-volatile memory undergoes either a reset operation that transitions a state from a low resistive state (LRS) to a high resistive state (HRS) or a set operation that transitions the state from the high resistive state to the low resistive state. The determination unit determines a unit-of-storage in which the number of errors in predetermined one of the reset operation and the set operation has exceeded a predetermined standard, as a unit-of-storage suspected of having a defect.

Growing community of inventors

Kanagawa, Japan

Haruhiko Terada