Nagano Keiki Co., Ltd.

Haruhiko Sekiya

Shuji Tohyama

Yusuke Abe

Hironori Kobayashi

Nobuhiko Akimoto

Yoji Serizawa

Toshiaki Okumura

Yasuo Watanabe

Takayuki Yokoyama

Ikuya Miyahara

Hayato Kobayashi

Kouzou Yamagishi

Yasutaka Ide

Shuzi Tohyama

A physical quantity measuring device includes: a metallic cylindrical case; a sensor module configured to detect a physical quantity; a synthetic-resin joint provided near a first open end of the cylindrical case, the joint being attached with the sensor module and provided with an introduction port for introducing a measurement target fluid; and a cover provided near a second open end of the cylindrical case. The cover includes a locking portion for locking the sensor module. The cylindrical case includes an engagement portion provided near the first open end and engaged with the joint and a crimp portion provided near the second open end, the crimp portion configured to be plastically deformed by crimping. The cover is attached to the cylindrical case by crimping the crimp portion.

Physical quantity measurement including improved corrosion protection

A sensor module and a joint are made of different metal materials. The sensor module includes a first portion located near a diaphragm and a second portion having a large-diameter portion whose diameter is larger than that of the first portion. A step engaged with a peripheral edge of the large-diameter portion is formed on the joint. The large-diameter portion and the joint are mutually bonded through a bonding portion. The bonding portion is bonded by a plastic deformation bonding that is so-called metal flow. A space is defined between the joint and the module body.

Pressure sensor including sensor module having diaphragm and joint attached with the sensor module

A physical quantity measuring device includes: a sensor module provided with a diaphragm; a joint to which the sensor module is attached, the joint including a pressure inlet for delivering fluid to be measured to the sensor module. The joint is made of a synthetic resin and includes a joint body and an elastically deformable claw provided to the joint body and configured to lock the sensor module. Since the claw keeps the sensor module to be held by virtue of the elastic force of the claw, a further attachment process such as welding for attaching the sensor module to the joint is unnecessary. Since the joint body and the claw are integrally made of synthetic resin, it is not necessary to separately manufacture the joint body and the claw.

Physical quantity measuring device including a sensor module and a joint for locking the sensor module

A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.

Ceramic sensor module including diaphragm and cylindrical portion integrated with the diaphragm

Physical quantity measuring sensor including an O-ring between a cylindrical portion and a cylindrical projection

In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.

Fluid pressure sensor incorporating flexible circuit board

A pressure sensor (,) having a first terminal (,), the first terminal (,) including a horizontal portion (,) and a vertical portion (,) at an intermediate portion thereof and being elastically deformable. A portion of the first terminal (,) being inserted and soldered to a circuit substrate (,) has a collar portion (,) being abutted around a through-hole (,) of the circuit substrate (,). The first terminal (,) is fixed at a state being pressed to the circuit substrate (,) by the collar portion (,) and being slightly compressed between a base member (,). When the circuit substrate (,) and the base member (,) are spaced apart by circumambient heat, the first terminal (,) can follow by the compressed margin. When the first terminal (,) itself is thermally expanded, the first terminal (,) can follow by an elastic deformation of the horizontal portion (,) and the vertical portion (,). Accordingly, stress caused to the soldered portion by a thermal deformation and the like can be relaxed so that the pressure sensor (,) can be applied to a wider temperature range.

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Tokyo, Japan

Haruhiko Sekiya