Murata Manufacturing Co., Ltd.

Haruhiko Mori

Hiroyuki Otsuna

Mitsuyoshi Nishide

Yoshihito Otsubo

Norio Sakai

Shinichiro Banba

Koichi Saito

Tadahiro Nakagawa

Noriyuki Inoue

Hiromasa Saeki

Akira Baba

Akihiro Tsuru

Shizuma Tazuke

Tomohiro Kato

Koichi Kanryo

Takeo Arakawa

Yutaka Iseki

Shigehiro Nojiri

Kensuke Aoki

Yoshinori Sakamoto

Takayuki Nagano

Makota Muranaka

Ikuko Hiramatsu

Toshiyuki Nomura

Tatsuya Toudo

Isao Tamaki

Hisashi Yoshika

A packaged solid-state battery that includes a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface; a supporting substrate supporting the bottom surface of the solid-state battery; an insulating cover layer covering at least the top surface and the side surfaces of the solid-state battery; and an inorganic cover film on the insulating cover layer.

Solid-state battery

A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.

Inductor component

A method for manufacturing an electronic component including a step of providing an outer electrode that includes a step of providing a sintered layer containing a sintered metal, a step of providing an insulation layer containing an electric insulation material, and a step of providing a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof. The insulation layer is directly provided on the sintered layer at each of the end surfaces so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.

Method for manufacturing electronic component

In a method for manufacturing an electronic component, a step of providing an outer electrode includes a step of providing a sintered layer including a sintered metal, a step of providing a reinforcement layer not containing Sn but including Cu or Ni, a step of providing an insulation layer, and a step of providing a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover Bich. The reinforcement layer covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.

A capacitor that includes a conductive base material with high specific surface area, a dielectric layer covering the conductive base material with high specific surface area, and an upper electrode covering the dielectric layer, in which the conductive base material with high specific surface area is formed of a metal sintered body as a whole.

Capacitor and method for manufacturing the same

In an electronic component, an outer electrode includes a sintered layer containing a sintered metal, an insulation layer containing an electric insulation material, and a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof so as to cover each of the end surfaces of the element assembly. The insulation layer is directly provided on the sintered layer at each of the end surfaces of the element assembly so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.

Electronic component and method for manufacturing the same

In an electronic component, an outer electrode includes a sintered layer including a sintered metal, a reinforcement layer not containing Sn but including Cu or Ni, an insulation layer, and a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover each end surface of the element assembly. The reinforcement layer extends on the sintered layer and covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly, extends in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.

A die for fabricating a carrier tape such that the carrier tape is provided with a plurality of housing holes for housing electronic components therein in a state where the housing holes are arranged in a longitudinal direction and penetrates the carrier tape in a thickness direction. The die is less prone to be damaged and is less prone to induce breakages in the interval portions between the housing holes in the carrier tape. A male die includes housing-hole formation convex portions which are constituted by a plurality of first housing-hole formation convex portions having respective tip ends at a relatively-higher heightwise position, and a plurality of second housing-hole formation convex portions having respective tip ends at a relatively-lower heightwise position.

Carrier-tape fabrication die and carrier-tape fabrication method

A series of electronic components formed using a carrier tape. The carrier tape is adapted to enable smoothly picking up even small-sized electronic components with a suction nozzle. The carrier tape has housing holes housing electronic components therein. The housing holes are arranged in the longitudinal direction. A top tape and a bottom tape are attached to the upper and lower surfaces of the carrier tape. Interval portions between the housing holes are provided with concave slots in their lower surfaces, thereby forming air flow paths. The air flow paths form air passages which enable smoothly picking up the small-sized electronic components using a suction nozzle.

Carrier tape, package tape and series of electronic components

A pressing device and a pressing method, wherein the method includes the steps of accommodating a stacked layer structure in a recess in a die body, and pressing the stacked layer structure in the recess of the die body between a bottom plate of the die body that forms a bottom wall of the recess and a top die, while laterally supporting sides or side walls of the die body that form side walls of the recess. The pressing device includes a die body which is small, light, and easy to handle, and also includes thrust mechanisms for laterally positioning the die body. The thrust mechanisms also laterally support the side walls of the die body when a stacked layer structure in the recess of the die body is pressed between the bottom plate of the die body and a top die. The pressing method makes it possible to press a ceramic stacked layer structure efficiently using the small and light die body.

Method of pressing a ceramic stacked layer structure

A manufacturing method for a monolithic ceramic part permitting a ceramic laminate to be cut stably and speedily, even if the thickness of the ceramic laminate is large. In order to divide a mother ceramic laminate into individual laminates of monolithic ceramic part units, the ceramic laminate is cut with a cutting blade, using a pair of guides disposed on opposite sides of the cutting blade in the vicinity of one principal plane of the ceramic laminate to control the cutting direction, and then individual ceramic laminates thus obtained by cutting are fired.

Manufacturing method for monolithic ceramic part and cutting device for ceramic laminate

Device for pressing a ceramic stacked layer structure

The present invention is to produce a ceramic green sheet with an even thickness. By supplying a ceramic slurry to a slurry room comprising a slurry coater, contacting a carrier film to the fringe part of an opening of the slurry room with pressure so as to close the opening, and moving the carrier film along the opening in the state, a ceramic green sheet made from the slurry can be formed on the carrier film. At the time, based on the actual flow rate data on the actual flow rate of the slurry measured by the flow meter and the actual thickness data on the actual thickness of the green sheet measured by the film thickness meter, appropriate flow rate data on the appropriate flow rate of the slurry to be supplied for obtaining a green sheet with a desired thickness are sought in an appropriate flow rate data calculating means so that the flow rate of the slurry is controlled by the flow rate controlling means based thereon.

Method and apparatus for producing a green sheet with an even thickness

A method of preparing a multilayer ceramic component including capacitor therein includes the steps of carrying a long ceramic green sheet along its longitudinal direction and measuring the thickness thereof while carrying the same, forming an internal electrode on the long ceramic green sheet subjected to the measurement of the thickness, punching out the long ceramic green sheet provided with the internal electrode into prescribed dimensions and stacking the punched ceramic green sheets with each other by a number obtained on the basis of the measured value of the thickness for obtaining a laminate, obtaining a ceramic sintered body by firing the laminate.

Method of manufacturing multilayer ceramic component including capacitor

A method of preparing multilayer ceramic component including capacitor therein includes the steps of carrying a long ceramic green sheet along its longitudinal direction and measuring the thickness thereof while carrying the same, forming an internal electrode on the long ceramic green sheet subjected to the measurement of the thickness, punching out the long ceramic green sheet provided with the internal electrode into prescribed dimensions and stacking the punched ceramic green sheets with each other by a number obtained on the basis of the measured value of the thickness for obtaining a laminate, obtaining a ceramic sintered body by firing the laminate.

Growing community of inventors

Nagaokakyo, Japan

Haruhiko Mori