Mitsubishi Electric Corporation

Haruhiko Minamitake

Kenji Suzuki

Hidenori Koketsu

Yuki Haraguchi

Yusuke Miyata

Taiki Hoshi

Kazuaki Mikami

Takuya Yoshida

Akira Kiyoi

Kazunori Kanada

A first buffer layer includes: a first region containing protons and in contact with a drift layer; a second region between the first region and a first principal surface containing protons, and in contact with the first region; and a third region between the second region of the first buffer layer and the first principal surface. An impurity concentration profile of the first buffer layer includes: a maximum value in the second region; a kink at a boundary point between the first region and the second region, relaxing or stopping a decrease from the maximum value; a value at the boundary point higher than or equal to 80% of the maximum value; and a distribution of the third region longer than or equal to 5 μm and having an impurity concentration lower than the value at the boundary point and lower than or equal to 5.0×10/cm.

Semiconductor device

A semiconductor device according to the present disclosure includes: a first conductivity-type silicon substrate including a cell part and a termination part surrounding the cell part in plan view; a first conductivity-type emitter layer provided on a front surface of the silicon substrate in the cell part; a second conductivity-type collector layer provided on a back surface of the silicon substrate in the cell part; a first conductivity-type drift layer provided between the emitter layer and the collector layer; a trench gate provided to reach the drift layer from a front surface of the emitter layer; and a second conductivity-type well layer provided on the front surface of the silicon substrate in the termination part. Vacancies included in a crystal defect in the cell part are less than vacancies included in a crystal defect in the termination part.

Semiconductor device and manufacturing method therefor

Provided is a method for manufacturing a semiconductor device utilizing the feature that there are a plurality of semiconductor substrates to measure the thickness thereof, when measuring the thickness of a plurality of semiconductor substrates upon the laser annealing treatment. For each of at least one semiconductor substrate of the plurality of semiconductor substrates, a laser annealing treatment is performed by controlling a laser beam irradiating the semiconductor substrate based on self-thickness data being data of a result of measurement of a thickness of the semiconductor substrate and reference thickness data being data of a result of measurement of a thickness of at least one semiconductor substrate other than the semiconductor substrate among the plurality of semiconductor substrates.

Manufacturing method of semiconductor device and semiconductor manufacturing apparatus involving thickness measurements

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Tokyo, Japan

Haruhiko Minamitake