Sony Corporation

Haruhiko Makino

Kenji Ohsawa

Hidetoshi Kusano

Hideyuki Takahashi

Kenji Osawa

Kazuhiro Sato

Makoto Ito

Hiroyuki Shigeta

Akira Kojima

Hiroyuki Fukasawa

Sakan Iwashita

There is provided a semiconductor device and a lead frame that form a stable external ring structure wherein bonding strength and mechanical strength between the external ring and sealing resin is improved. A semiconductor device ( ) is formed which comprises a semiconductor chip ( ) having a plurality of electrode pads ( ) formed at the periphery of a front surface thereof, a wiring film ( ) located and formed on the front surface side of the semiconductor chip ( ) by laminating an insulation film ( ) on a lead pattern ( ), outer connection terminals ( ) formed so as to protrude above the wiring film ( ), a plurality of leads ( ) extending form the wiring film ( ) and connected to the electrode pads ( ) on the semiconductor chip ( ) at extended tip ends thereof, an external ring ( ) provided so as to surround the semiconductor chip ( ) and formed with a plurality of through holes or blind holes ( ), and a sealing resin ( ) filled between the semiconductor chip ( ) and the external ring ( ).

Lead frame and semiconductor device having the same

An electronic parts mounting board includes an electrode circuit base member having electrodes on at least one surface; projecting electrodes bonded to the electrodes of the electrode circuit base member; an insulating member provided on the electrode circuit base member in such a manner as to insulate the electrodes of the electrode circuit base member and the projecting electrodes; and circuit electrode patterns provided on the insulating member and the projecting electrodes. In this mounting board, the projecting electrodes are formed by forming specific projecting conductive members at specific positions of the circuit electrode patterns by plating, and pressing the projecting conductive members in the insulating member so as to pass through the insulating member and reach the electrodes of the electrode circuit base member. The mounting board is capable of connecting circuit electrode patterns to a specific electrode base member via small contacts comparable to those obtained by a photo via process at a high positional accuracy, and improving the flatness and adhesive force of the circuit electrode patterns, without use of an expensive laser system for drilling.

Electronic parts mounting board and production method thereof

A semiconductor apparatus includes a semiconductor device and a wiring member having an insulating resin base, wiring layers connected to the individual electrodes of the semiconductor device, and external terminals. The semiconductor device or a reinforcing plate placed around the semiconductor device and the wiring member are bonded to each other with an insulating elastic material therebetween. The insulating elastic material retains rubber elasticity under the environmental conditions of the fabrication process and of use. An electronic system includes a semiconductor apparatus as described above.

Semiconductor apparatus and electronic system

Metal films (for instance, gold films or palladium films) to constitute bumps are formed on a metal base by electrolytic plating. Then, a circuit wiring including inner leads is formed by electrolytic plating with a metal so that the inner leads are connected to the respective metal films.

Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus

In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portions. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.

Lead frame, semiconductor package having the same and method for manufacturing the same

In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portiones. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.

Lead frame and semiconductor package having a lead frame

Lead frame, manufacturing method of a lead frame, semiconductor device,

A ultra thin resin mold semiconductor device can be provided. A resin mold type semiconductor device is arranged so that a semiconductor chip is disposed within a range of the thickness of a lead frame and sealed with a resin mold, that the thickness of the semiconductor device is defined by the thickness of the lead frame, and that an upper surface, a lower surface and a side surface of a terminal portion formed by the lead frame are exposed from the surface of the resin mold.

Resin mold type semiconductor device

A semiconductor device including a lead frame provided with a die pad and a plurality of leads arranged around the die pad, a semiconductor element mounted on the die pad, and a molding resin for sealing the semiconductor element. A spacing defined between the die pad and the leads is sized, i.e. made very small, that a flow velocity of a first portion of the molding resin flowing in a peripheral region of the semiconductor element becomes substantially equal to a flow velocity of a second portion of the molding resin flowing on at least an upper surface of the semiconductor element. That is, the first portion of the molding resin flowing in the peripheral region of the semiconductor element receives resistance due to the very small spacing between the die pad and the leads. Accordingly, the flow of the molding resin as a whole can be made uniform to thereby reduce or eliminate the generation of voids in the molding resin. As a result, reliability and productivity of the semiconductor device can be improved.

Growing community of inventors

Kanagawa, Japan

Haruhiko Makino