Murata Manufacturing Co., Ltd.

Haruhiko Ikeda

Takuo Wakaoka

Norikazu Kume

Tatsuhiro Numoto

Atsushi Kishimoto

Osamu Chikagawa

Shuji Matsumoto

Tatsuya Funaki

Takayoshi Obata

Takehito Ishihara

Osamu Nakao

An electrode-equipped passive component is an electrode-equipped passive component to be mounted on a mount target, and includes a passive component main body, an electrode provided on a mount surface of the passive component main body, and an underfill layer provided on the mount surface of the passive component main body. The underfill layer includes a thermosetting resin, a flux, and a solvent, and has a surface having a skin layer. The skin layer has tack power equal to or smaller than 25 mN/mmat room temperature and equal to or larger than 60 mN/mmat 40&#xb0; C.

Electrode-equipped passive component and collective body of electrode-equipped passive components

A vapor chamber that includes a housing; a pillar arranged in the housing; a working fluid sealed in the housing; and a wick arranged in the housing. The pillar has a first bottom surface and a second bottom surface, and pores therein. The first bottom surface is in contact with a first main interior surface of the housing and the second bottom surface is in contact with the wick. The first bottom surface has an area larger than an area of the second bottom surface. The pillar has a side surface connecting a periphery of the first bottom surface and a periphery of the second bottom surface. A cross-sectional area of the pillar decreases along a direction from the first bottom surface to the second bottom surface.

Vapor chamber having pillars with decreasing cross-sectional area

A vapor chamber that includes a housing, a wick structure joined to a major inside surface of the housing, and a working liquid enclosed inside the housing. The wick structure is joined to the housing at a joint portion within a joint region, and a proportion of a total area of the joint portion within the joint region to an area of the joint region is 50% or less.

Vapor chamber

A vapor chamber includes a housing including first and second sheets that face each other and that include respective outer edge portions joined to each other, supports that support the first and second sheets from inside and that are disposed therebetween, and a hydraulic fluid enclosed in the housing. The first and second sheets do not include an angled portion having an angle of about 90&#xb0; or less between a joint and a support nearest to the joint. The expression 0.02&#x2264;b/a&#x2264;0.3 is satisfied, where a is a distance from an outer edge of the outermost support to an inner edge of the joint between the first and second sheets, and b is a distance between the first and second sheets at the outer edge of the outermost support.

A vapor chamber that includes a casing, a pillar in an internal space of the casing and that supports the casing from an inside thereof, a working fluid in the internal space of the casing, and recessed portions in at least a portion of a main external surface of the casing.

In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first electrode pattern being provided on a first supporting layer. A second supporting layer including a second electrode pattern is press-bonded onto the electronic component-fixed surface of the first supporting layer with a first prepreg therebetween to perform transfer. Then, the first supporting layer and the second supporting layer are separated from the first prepreg. After separation, the first prepreg is cured. A second electronic component is connected and fixed onto the back surface of the second electrode pattern with a conductive bonding material. A third supporting layer including a third electrode pattern is press-bonded onto the second electronic component-fixed surface with a second prepreg therebetween to perform transfer. Then, the third supporting layer is separated from the second prepreg, and the second prepreg is cured. In this manner, the prepregs and electrode patterns are sequentially laminated, thereby reducing the connection resistance between laminated electrode patterns or between an electrode pattern and an electronic component.

Process for substrate incorporating component

The present invention relates to a method of bonding a conductive adhesive and an electrode together, which is capable of obtaining electrical bonding between a conductive electrode and an electrode. In this method, a conductive adhesive containing a conductive filler and an organic binder is coated on an electrode having a layer formed thereon by plating a low-melting-point material, and then heated to cure the organic binder and melt the plated layer on the electrode. As a result, the conductive filler contained in the adhesive enters the plated layer to obtain strong bonding between the plated layer and the conductive filler.

Method of bonding a conductive adhesive and an electrode, and a bonded electrode obtained thereby

The invention provides a mounting structure of an electronic part comprising an electronic part element (,) in association with a terminal electrode (,) and mounted on a substrate (,) via an adhesive (,) characterized in that a functional group having a nucleophilic substituting property is on a surface of said terminal electrode (,) and said terminal electrode (,) is bonded to said adhesive (,) by interatomic bonding. The invention also provide a method of mounting the electronic part. Bonding strength between the electronic part and the substrate is provided by not only mechanical bonding but also chemical bonding.

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Nagaokakyo, Japan

Haruhiko Ikeda