Fujitsu Corporation

Haruhiko Horizoe

Hiroshi Yamamoto

Naoya Yamazaki

Hideki Zenitani

Hidehiko Hizuka

Hisato Sato

Shinji Hiramatsu

Natsuo Masuda

Manabu Matsumoto

Toshihiko Motoseko

Mitsuo Okawachi

A power supply apparatus for a package, in which power is supplied to a package connected to a shelf, aiming at supplying power to the package without using signal pins of a connecting part on a back wiring board and reducing voltage drop at a pattern on the back wiring board to a negligible degree. A fitting section of a package printed board and a fitting section are fitted to each end of a tab of the back wiring board, and a fitting section of a package printed board and a fitting section are fitted to each end of a tab of the back wiring board. Further, a connector on the package side of package printed board and a connector are fitted to each end of a signal terminal group of the back wiring board.

Power supply apparatus for package

A cooling structure for LSI or the like devices to be mounted in a small size electronic apparatus housing. A main printed circuit board has mounted thereon first electronic devices with low heat generation; at least one auxiliary printed circuit board has mounted thereon a second electronic device with high heat generation, which is connected with one edge of the main printed circuit board (1) through a flexible printed circuit tape (5); a holder (6) fixed on the main printed circuit board (1) for resiliently supporting the auxiliary printed circuit board (2) at a distance above the former when the latter is turned over and is above the main printed circuit board (1) by bending the flexible printed circuit tape (5) so that a heat conductive surface of the second electronic device (4) is exposed outside. This printed circuit board assembly (A) is accommodated in a housing (B) made of a heat conductive material so that the heat conductive surface of the second electronic device (4) is brought into close and resilient contact with the inner wall (14) of the hosing (B).

Cooling structure for electronics devices

Growing community of inventors

Kawasaki, Japan

Haruhiko Horizoe