Heptagon Micro Optics Pte. Ltd.

Ams Sensors Singapore Pte. Ltd.

Heptagon Oy

Ams Sensors Asia Pte. Ltd.

Hartmut Rudmann

Markus Rossi

Simon Gubser

Stephan Heimgartner

Mario Cesana

Alexander Bietsch

Jens Geiger

Ji Wang

Susanne Westenhöfer

Nicola Spring

Bojan Tesanovic

Qichuan Yu

Peter Roentgen

Tobias Senn

John A Vidallon

Xu Yi

Jukka Alasirnio

Matthias Gloor

Kam Wah Leong

Qi Chuan Yu

Sonja Hanselmann

Bassam Hallal

Robert Lenart

Ville Kettunen

Thng Chong Kim

Kian Siang Ng

Moshe Doron

Ohad Meitav

Florin Cutu

Martin Lukas Balimann

Vincenzo Condorelli

Kai Engelhardt

James Eilertsen

Alireza Yasan

Philippe Bouchilloux

Michel Barge

Camilla Camarri

Christoph Friese

Susanne Westenhoefer

Miguel Bruno Vaello Paños

Edmund Koon Tian Lua

Michael Kiy

Kyu Won Hwang

Ming Jie Lee

Sundar Raman Gnana Sambandam

Matthias Maluck

Andreas Maciossek

Devanraj Kupusamy

Diane Morgan

Jian Tang

Myo Paing

Christian Tang-Jespersen

Hongyuan Liu

Eunice Ho Hui Ong

James Patrick Long

Daniel Pérez Calero

Liu Yang

Peter Riel

Hans Peter Herzig

Julien Boucart

Guo Xiong Wu

Hendrik Volkerink

Han Nee Ng

Mai-Lan Elodie Boytard

Sai Mun Chan

Cris Calsena

Ramon Opeda, Jr

Attilio Ferrari

Martin Schubert

Tae Yong Ahn

Ali Naqavi

Nicole Ebentheuer

Sebastiano Lazzi Gazzini

Lukas Steinmann

René Kromhof

Samuele Laffranchini

Alexander Bietesch

Jürgen Soechtig

Renè Kromhof

Daniel Infante Gomez

Philipp Mueller

Sundar Raman Ghana Sambandam

Daniel Perez Calero

Jukka ALASIRNIÖX

An optical module () comprises an emitter () configured to emit electromagnetic radiation and a first substrate () configured to support the emitter (). The optical module () further comprises a driver () configured to control the emitter () and a second substrate () configured to support the driver (). The first substrate () has a greater thermal conductivity than the second substrate ().

Light emitting module combining enhanced safety features and thermal management

An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.

Optoelectronic modules including an optical emitter and optical receiver

The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.

Manufacture of optical light guides

A method of manufacturing a plurality of optical elements () comprising the steps of providing a substrate (), and a tool () comprising a plurality of replication sections (), each defining a surface structure of one of the optical elements (), the tool () further comprising at least one contact spacer portion (), aligning the tool () and the substrate () with respect to each other and bringing the tool () and a first side of the substrate () together, with replication material () between the tool () and the substrate (), the contact spacer portion () contacting the first side of the substrate (), and thereby causing the spacer portion () to adhere to the first side of the substrate (), hardening the replication material (), wherein the substrate () has yard line features () around at least a portion of the replication sections (), the yard line features () containing the replication material () on a first side of the yard line with respect to the tool () and the substrate ().

Yard control features

Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Compact opto-electronic modules and fabrication methods for such modules

The device () comprises a first member () and a second member () which are stacked upon each other in a direction vertical direction. The first and second members comprise a central portion (C; C) each, and the first member () comprises at least a first distancing element () abutting the second member (). The device () comprises a gap zone (G) and a bonding material (), wherein the gap zone is peripheral to the central portions (C; C), and in the gap zone (G), a gap () is present between the first and second members. A portion of the gap () is filled by the bonding material () bonding the first and second members to each other in a bonding zone (B) comprised in the gap zone. A height (h) of the gap () is defined by the first distancing element ().

Wafer-level manufacture of micro-devices and related two-piece devices, in particular micro-optical systems

This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.

Optoelectronic modules having locking assemblies and methods for manufacturing the same

Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

Image sensor modules including primary high-resolution imagers and secondary imagers

The method for manufacturing a multitude of devices comprises: And it further comprises, after the conditioning: The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.

Method for conditioning a replication tool and related method for manufacturing a multitude of devices

An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

Optoelectronic module assembly and manufacturing method

A method for manufacturing an optical device comprising providing a plurality of initials bars each having a first side face presented with a first optical component arrangement; positioning the initial bars in a row with their first side faces facing a neighboring one of the initial bars; fixing the initial bars to obtain a bar arrangement; obtaining prism bars by segmenting the bar arrangement by at least one of the steps: conducting a plurality of cuts so that each prism bar comprises a portion of at least two different ones of the initial bars, separating the bar arrangement into sections along cut lines or by creating cut faces at an angle with initial-bar directions; dividing the first optical component arrangement for obtaining a plurality of passive optical components, wherein each prism bar comprises one or more passive optical components comprising a first reflective face each which is of non-planar shape; segmenting prism bars into parts.

Miniaturized optical devices, such as spectrometers and spectrometer modules, and their manufacture

The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

Thin optoelectronic modules with apertures and their manufacture

Manufacturing opto-electronic modules () includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack () in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules () can be obtained by separating the wafer stack () into separate modules.

Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same

A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.

Assembly of wafer stacks

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Jona, Switzerland

Hartmut Rudmann