Evatec Ag

Oc Oerlikon Balzers Ag

Oerlikon Advanced Technologies Ag

Hartmut Rohrmann

Heinz Felzer

Martin Bless

Claudiu Falub

Dominik Jaeger

Stanislav Kadlec

Martin Dubs

Jürgen Weichart

Oliver Rattunde

Marcel Neusch

Thomas Tschirky

Marco Rechsteiner

Hubert Breuss

Peter Schlegel

Hanspeter Friedli

Valentin Falub Claudiu

Michael Cheseaux

A sputtering device to sputter a liquid target. The sputtering device including a trough to receive a liquid target material and a device to stir or agitate the liquid target material. The device configured to degas the liquid target material or/and to dissipate solid particles or islands on a surface of the target or/and to move such particles or islands from an active surface region to a passive surface region and/or vice-versa, whereby the passive surface region is at least 50% less exposed to sputtering as the active surface region.

Liquid sputter target

In a magnetron sputtering reaction space a magnetron magnetic field is generated. A further magnetic field is generated in the reaction space whereby a resultant magnetic field has a directional component parallel to a target plane which is larger than the directional component of the magnetron magnetic field parallel to the target plane in the reaction space.

Methods of and apparatus for magnetron sputtering

A substrate processing apparatus includes a base with a process-side surface and a substrate support arranged on the process-side surface and designed to carry a substrate at its periphery. The periphery, more specifically the plane defined by the periphery, is spaced apart from the process-side surface. The substrate processing apparatus also includes a radiation sensor adapted to measure electromagnetic radiation arranged on a side of a back-side surface of the base. A radiation channel is arranged between the radiation sensor and the periphery of the substrate support, more specifically between the radiation sensor and the plane defined by the periphery, wherein the radiation channel is at least partially permeable to electromagnetic radiation.

Substrate processing apparatus and method of processing a substrate and of manufacturing a processed workpiece

For producing a directional layer for instance with constant nominal directionality, such as a low-retentivity layer with a preferred direction of magnetization or a support layer for such a layer by cathode sputtering on a substrate surface (), the coating process takes place in a manner whereby particles emanating from a target surface () impinge predominantly from directions whose projections onto the substrate surface () lies within a preferred angular range surrounding the nominal direction. This is achieved for instance by positioning a collimator (), encompassing plates () that extend at a normal angle to the substrate surface () parallel to the nominal direction in front of the substrate surface (), but in lieu of or in addition to such positioning the location or movement of the substrate surface () relative to the target surface () can also be suitably adjusted or controlled.

Method for producing a directional layer by cathode sputtering, and device for implementing the method

So as to provide a target arrangement with improved mounting and dismounting ability, the target arrangement comprises a plate along a plane (E) which has a border () defined by a first wedge surface () angled to the addressed general plane (E) and a second wedge surface () which is substantially planar as well and angled with respect to the generic plane (E). The two wedge surfaces mutually convert in a direction along the addressed plane (E) and from a more central area of the plate outwardly.

Target arrangement for mounting / dismounting and method of manufacturing

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Schriesheim, Germany

Hartmut Rohrmann