Merck Patent Gesellschaft MIT Beschrankter Haftung

Ciba-geigy Corporation

Hartmut Hartner

Hans Bardonner

Rudolf Klug

Arno Basedow

Peter C Schmidt

Hans-Joachim Merrem

Hans-Wolfgang Hugenbusch

Friedrich Reiff

Ekkehard Bartmann

Michael Romer

Manfred Kieser

Ulrich Heywang

Michael Casutt

Ernst Felder

Klaus-Dieter Franz

Klaus Bernhardt

Reinhard Schulz

Ingeborg Stein

Constanze Prengel

Karl H Neisius

Ulrich Fechtel

Axel Von Daacke

Gerald Faller

Bruno Wollemann

Karlheinz Neisius

Wolfgang Fruhstorfer

Process for preparing 2-arylbenzimidazole-5-sulfonic acids

Materials coated with plate-like pigments and characterized in that the coating shows structuring in defined areas due to a difference in the orientation of the pigment particles are highly suitable in the area of general security printing.

Materials coated with plate-like pigments

A process for the production of hydroxyamines of the formula I

Process for the preparation of hydroxyamines

The invention relates to negative photoresists of the polyimide type essentially containing, in an organic solvent, in each case at least

Negative photoresists of the polyimide type containing 1,2-disulfones

A modified sorbitol with improved tableting properties, viz, has a melting point of about 96.degree. C., a bulk density of 0.3-0.6 g/ml, a .gamma.-sorbitol content of at least 90%, a purity of at least 98%, a specific surface area of 0.7-1.5 m.sup.2 /g, a bending strength of at least 7 N/mm.sup.2 at a compressive force of at least 10,000 N, and a friability of less than 1% at a compressive force of at least 10,000 N, can be prepared by obtaining a sorbitol solution by hydrogenation of crystallized glucose at a temperature below 170.degree. C., and spray-drying this solution at a temperature of 140.degree. to 170.degree. C. The sorbitol thus obtained has a water content of less than 1%. The sorbitol is useful for the production of compressed formulations.

Sorbitol, process for its preparation, and use thereof

Photoresists suitable for use for forming relief structures of highly heat-resistant polymers and which contain soluble polymeric precursors which carry radiation-reactive radicals bonded through carboxylic ester groups have an increased light-sensitivity when they also contain at least one radiation-reactive, polymerizable allyl compound which has a boiling point above 180.degree., the allyl group thereof being bonded via an oxygen, sulfur and/or nitrogen atom. The highly heat-resistant polymers which can be prepared by means of these photoresists have excellent chemical, electrical and mechanical properties.

Photoresists suitable for forming relief structures of highly

An improved development process for relief structures based on radiation-crosslinked polymeric precursors of polymers which are resistant to high temperature in which the development fluid used is an aliphatic or cycloaliphatic ketone having 3 to 7 carbon atoms, is distinguished by rapid and complete removal of soluble polymeric material from the substrate with, at the same time, a minimum amount of attack on the radiation-crosslinked polymeric structures.

Process for the development of relief structures based on

A process for the preparation of [2,2]-paracyclophane comprises contacting aqueous p-methylbenzyltrimethylammonium hydroxide with sodium hydroxide or potassium hydroxide, in the presence of dimethyl sulfoxide, and preferably in the further presence of an inert water-immiscible organic solvent.

Process for the preparation of [2,2]-paracyclophane

A process for preparing an N,N-disubstituted p-phenylenediamine of the formula ##STR1## wherein R.sup.1 is alkyl of 1-6 C atoms, R.sup.2 is alkyl of 1-6 C atoms or alkyl of 1-6 C atoms which is substituted by OH, lower alkoxy, a sulfo group or an alkylsulfonamido group and R.sup.3 is hydrogen or lower alkyl

Process for preparing N,N-disubstituted p-phenylenediamine derivatives

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Muhltal, Germany

Hartmut Hartner