Core Scientific, Inc.

Core Scientific Operating Company

Harsh Patel

Thomas Middleton Rutledge Fuller

Devon Baldwin

A heat sink for cooling computing devices is disclosed. The heat sink includes a plurality of fin stages arranged in spaced relation between an intake side and an exhaust side. The plurality of fin stages each include a plurality of fins extending along a flow direction. At least one of the plurality of fin stages is distinct in fin width and/or fin height from another one of the plurality of fin stages.

Heat sink that varies in height

A system for the reclamation of energy generated from computing devices disposed within a data center may include at least one rack, an exhaust duct, and a damper. The at least one rack may include a plurality of computing devices. The exhaust duct may be disposed adjacent to the at least one rack and may be configured to receive exhaust air from the computing devices. The damper may be disposed within the exhaust duct and may be configured to release at least some of the exhaust air into the data center when an ambient temperature of the data center reaches a predetermined threshold.

Waste energy reclamation with dampers

Systems and methods for managing airflow for cooling computing devices (e.g. in a data center) in normal and cold environments are disclosed. In one embodiment, the method comprises positioning the computing devices on a plurality of racks with air barriers to create hot and cold aisles. The computing devices may be configured in a first mode to draw in cool air the cold aisles and exhaust heated air into the hot aisles. Temperatures in the cold aisles may be periodically measured. In response to temperatures below a predetermined threshold, one or more of the cold aisles may be converted into a temporary hot aisle by adjusting ventilation openings and configuring a subset of the computing devices to temporarily draw in warm air from the temporary hot aisle.

Thermal management for container-based data centers

A system and method for recapturing waste heat from computing devices are disclosed. The system includes at least one computing device, a heating, ventilation, and air conditioning (HVAC) unit, an exhaust duct leading from the computing device to the HVAC unit, a bypass duct fluidly connected to the exhaust duct for bypassing the HVAC unit, a control valve disposed in the exhaust duct, and a controller operatively connected to the control valve. The control valve is switchable between an open position where a flow of exhaust air is sent to the HVAC unit, and a closed position where the flow of exhaust air is redirected to the bypass duct.

System for recapturing waste heat from computing devices

A heat sink for cooling computing devices such as in a data center is disclosed. The heat sink includes a plurality of fin stages arranged in spaced relation between an intake side and an exhaust side. The plurality of fin stages have a height that increases from the intake side to the exhaust side.

A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack. The air barrier may have openings for the computing devices to permit exhaust air to flow through the air barrier into a hot aisle. The rack maybe configured to be connected to other similar racks to form a vertical annular hyperboloid or a vertical hyperbolic annular paraboloid, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular hyperboloid or a vertical hyperbolic annular paraboloid to improve airflow.

Rack for cooling computing devices in a hyperboloid configuration

Systems and methods for managing airflow for cooling computing devices in a data center in normal and cold environments are disclosed. Computing devices are positioned on racks, and an air barrier may be connected to the racks and have openings configured to permit air to be drawn through the computing devices by cooling fans. In a first mode, cool air may be drawn in from a cold aisle, and heated air may be exhausted into a hot aisle. Temperature sensors may periodically measure temperatures for the cool air being drawn into the computing devices. A controller may select a subset of the computing devices for air flow reversal in response to the measured temperatures being below a predetermined threshold. Patterns that may be time-varying and temperature-varying may be used to select the computing devices for air flow reversal and to adjust the fan speed of the computing devices.

Growing community of inventors

Stone Mountain, GA, United States of America

Harsh Patel