Infineon Technologies Austria Ag

Infineon Technologies Americas Corp.

Harsh Naik

Robert Paul Haase

Ralf Siemieniec

Martin Poelzl

Oliver Blank

Michael Hutzler

Ling Ma

Martin Henning Vielemeyer

David Laforet

Li Juin Yip

Cedric Ouvrard

Sylvain Leomant

Britta Wutte

Heimo Hofer

Ashita Mirchandani

Adam Amali

Jyotshna Bhandari

Anita Brazzale

Timothy Donald Henson

Niraj Ranjan

Adrian Finney

Ingmar Neumann

A semiconductor device includes: a semiconductor substrate; a drift zone of a first conductivity type in the semiconductor substrate; an array of interconnected gate trenches extending from a first surface of the semiconductor substrate into the drift zone; a plurality of semiconductor mesas delimited by the array of interconnected gate trenches; a plurality of needle-shaped field plate trenches extending from the first surface into the plurality of semiconductor mesas; in the plurality of semiconductor mesas, a source region of the first conductivity type and a body region of a second conductivity type separating the source region from the drift zone; and a current spreading region of the first conductivity type at the bottom of the gate trenches and having a higher average doping concentration than the drift zone. Methods of producing the semiconductor device are also described.

Semiconductor device having a current spreading region

A semiconductor device is described. The semiconductor device includes: a semiconductor substrate having a first main surface; a plurality of gate trenches extending from the first main surface into the semiconductor substrate; a semiconductor mesa between adjacent gate trenches; a first interlayer dielectric on the first main surface; a plurality of first metal contacts extending through the first interlayer dielectric and contacting gate electrodes disposed in the gate trenches; a plurality of second metal contacts extending through the first interlayer dielectric and contacting the semiconductor mesas; and an air gap or a dielectric material having a lower dielectric constant than the first interlayer dielectric between adjacent first and second metal contacts. Methods of producing the semiconductor device are also described.

Semiconductor device with semiconductor mesas between adjacent gate trenches

A method for manufacturing a semiconductor transistor device includes etching a vertical gate trench into a silicon region, depositing a silicon gate material on an interlayer dielectric formed in the vertical gate trench so that an upper side of the interlayer dielectric is covered, etching through the silicon gate material in the vertical gate trench to partly uncover the upper side of the interlayer dielectric and so that a silicon gate region of a gate electrode of the semiconductor transistor device remains in the vertical gate trench, and depositing a metal material into the vertical gate trench so that the partly uncovered upper side of the interlayer dielectric is covered by the metal material.

Semiconductor transistor device and method of manufacturing the same

A semiconductor device is described. The semiconductor device includes: a Si substrate having a first main surface; a plurality of gate trenches extending from the first main surface into the Si substrate; a semiconductor mesa between adjacent gate trenches; a first interlayer dielectric on the first main surface; a plurality of first metal contacts extending through the first interlayer dielectric and contacting gate electrodes disposed in the gate trenches; a plurality of second metal contacts extending through the first interlayer dielectric and contacting the semiconductor mesas; and an air gap or a dielectric material having a lower dielectric constant than the first interlayer dielectric between adjacent first and second metal contacts. Methods of producing the semiconductor device are also described.

Power semiconductor device having low-k dielectric gaps between adjacent metal contacts

A transistor device with a gate electrode in a vertical gate trench is described. The gate electrode includes a silicon gate region and a metal inlay region. The silicon gate region forms at least a section of a sidewall of the gate electrode. The metal inlay region extends up from a lower end of the gate electrode.

A semiconductor device includes a semiconductor substrate having drift and body regions. The drift region includes upper and lower drift regions. An active area includes a plurality of spicular trenches extending through the body region and into the drift region. Each spicular trench in the active area has a lower end which together define a lower end of the upper drift region extending towards a first side and a lower drift region extending from the lower end of the upper drift region towards a second side. The edge termination area includes spicular termination trenches extending at least into the upper drift region. A surface doping region arranged in the upper drift region in the edge termination area extends to the first side, is spaced apart from the lower end of the upper drift region, and has a net doping concentration lower than that of the upper drift region.

Semiconductor device having an edge termination area with trench electrodes at different electric potentials, and method for manufacturing thereof

Semiconductor device having a reduced surface doping in an edge termination area, and method for manufacturing thereof

In one implementation, a vertical field-effect transistor (FET) includes a substrate having a drift region situated over a drain, a body region situated over the drift region and having source diffusions formed therein, a gate trench extending through the body region, and channel regions adjacent the gate trench. The channel regions are spaced apart along the gate trench by respective deep body implants. Each of the deep body implants is situated approximately under at least one of the source diffusions, and has a depth greater than a depth of the gate trench.

Vertical FET having reduced on-resistance

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El Segundo, CA, United States of America

Harsh Naik