Infineon Technologies Ag

Qimonda Ag

Siemens Aktiengesellschaft

Siemens Medical Solutions USA, Inc.

Epcos Ag

Intel Mobile Communications Gmbh

Qimonda Ag I.in.

Harry Hedler

Thorsten Meyer

Roland Irsigler

Barbara Vasquez

Jens G Pohl

Markus Brunnbauer

Jörg Zapf

Andreas Wolter

Gerd Frankowsky

Alfred Haimerl

Stephan Dobritz

Martin Spahn

Volker Lehmann

Karl Weidner

Timothy Hughes

Stefan Wirth

Jochen Thomas

Ingo Wennemuth

Peter Weitz

Markus Schieber

Jurgen Grafe

Bernd Römer

Judith Lehmann, Legal Representative

Torsten Meyer

Rolf Weis

Franz Kreupl

Maximilian Fleischer

Mark S Andreaco

Volker Strutz

Matthias J Schmand

Alexander Frey

Holger Woerner

Peter Carl Cohen

Daniel Reznik

Axel Brintzinger

Simon Muff

Dirk Scheibner

Arno Steckenborn

Jörg Hassel

Robert A Mintzer

Jochen M&uuml;ller

Octavio Trovarelli

Detlef Weber

Kerstin Wiesner

Uta Gebauer

Anton Legen

Jürgen Högerl

Matthias Georgi

Steffen Kroehnert

Stefan Ruckmich

Oliver Theile

Juergen Grafe

Henning Mieth

Oliver Freudenberg

Andreas Peschka

Klaus Röther

Philip Clissold Howell

Juergen Simon

Joerg Zapf

Karlheinz Amtmann

Dominik Braun

Hans-Peter Lindner

Delphine Meunier

Manfred Schreiner

Ingo Kuehne

Christof Thalhammer

Sven Rzepka

Michael Schiffer

An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.

Infrared sensor, thermal imaging camera and method for producing a microstructure from thermoelectric sensor rods

A three-dimensional micro-structure has a plurality of adjacent micro-columns which are arranged at a distance from each other and essentially parallel in relation to the respective longitudinal extension. The micro-columns are made of at least one micro-column material having respectively an aspect ratio in the region of 20-1000 and respectively a micro-column diameter in the region of 0.1 &#x3bc;m-200 &#x3bc;m. A micro-column intermediate chamber is arranged between adjacent micro-columns having a micro-column distance selected from between the adjacent micro-columns in the region of 1 &#x3bc;m-100 &#x3bc;m. According to a method for producing the three-dimensional micro-structures: a) a template is provided with template material, b) the micro-column material is arranged in the column-like cavities, and c) the template is at least partially removed.

Thermoelement including a three-dimensional microstructure, and method for producing a thermoelement

Disclosed herein is a method including disposing in a mold a powder that has a composition for manufacturing a scintillator material and compressing the powder to form the scintillator material; where an exit surface of the scintillator material has a texture that comprises a plurality of projections that reduce total internal reflection at the exit surface and that increase the amount of photons exiting the exit surface by an amount of greater than or equal to 5% over a surface that does not have the projections.

Method of manufacturing garnet interfaces and articles containing the garnets obtained therefrom

A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.

Micromechanical measuring element and method for producing a micromechanical measuring element

A force transducer, in particular a load cell, includes a spring body that deforms when loaded with a force or load to be measured. Two support parts, which are separated by a gap, are moved out of a position of rest. A capacitive displacement detector is used to detect the relative movement of the support parts, where the capacitor includes two electrode combs that are each held on one of the support parts and includes a multiplicity of electrode fingers. The electrode combs are configured designed and mounted on the two support parts such that the electrode fingers of the one electrode comb pass into the finger interspaces of the other electrode comb when the spring body is loaded so that the force transducer is resistant to overloading.

Force transducer forming a capacitive load cell

At least two separate single-crystal silicon layers are formed in a micromechanical substrate which has a diaphragm in a partial region. The diaphragm has a thickness of less than 20 &#x3bc;m and includes part of a first of the single-crystal silicon layers. The substrate construction also includes a heating element configured to generate a temperature of more than 650&#xb0; C. in at least part of the diaphragm. The substrate includes at least one diffusion barrier layer that reduces the oxidation of the first single-crystal silicon layer.

Micromechanical substrate for a diaphragm with a diffusion barrier layer

The invention relates to a radiation detector (), having a scintillator () for generating electromagnetic radiation () in response to the action of incident radiation (). The scintillator () has two opposing end faces () and a lateral wall () between the end faces (). The radiation detector has, in addition, a conversion system () located on the lateral wall () of the scintillator (), said system comprising a plurality of channels (). Each channel () has a photocathode section () for generating electrons () in response to the action of electromagnetic radiation () that is generated by the scintillator (), said electrons being multipliable by impact processes in the channels (). A detection system () for detecting electrons () that have been multiplied in the channels () of the conversion system () is also provided. The invention also relates to an imaging system () comprising a radiation detector of this type ().

Radiation detector and imaging system

The invention relates to a radiation detector (), having a scintillator () for generating electromagnetic radiation () in response to the action of incident radiation (). The scintillator () has two opposing end faces () and a lateral wall () between the end faces (). The radiation detector has, in addition, a photocathode section () that is located on the lateral electrons wall () of the scintillator () and that generates electrons () in response to the action of electromagnetic radiation () that is generated by the scintillator (), a microchannel plate () comprising a plurality of channels (), for multiplying the electrons () that have been generated by the photocathode section () and a detection system () for detecting the electrons () that have been multiplied by means of the microchannel plate (). The invention also relates to an imaging system () comprising a radiation detector of this type ().

A photonic crystal, which is a periodically arranged structure made of free-standing columns, has a base material of at least one metal or a metal alloy. Intermediate spaces between the columns allow passage of a gas to be analyzed. The photonic crystal has predefined imperfections, by which at least one resonator is formed, the resonant frequency of which is in a frequency range which is absorbed by a gas component to be detected. A heating unit heats at least some of the columns and at least one detector element extracts the energy present in the resonator in the heated state under the action of the gas to be analyzed. The device may have extremely small dimensions and very low energy consumption.

Device and system for selectively detecting gas components or concentrations of gas components in gas to be analyzed and method for operating such device

An integrated circuit with a substrate with a lower and an upper surface is described. A via extends between the upper and the lower surface of the substrate. The via contains a conductive filling material that comprises carbon.

Semiconductor chip with integrated via

A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the integrated circuit and the housing body, and one or more external contact devices in communication with the wiring device.

Component and method for producing a component

The present invention provides an apparatus having stacked semiconductor components. Two semiconductor components () are arranged such that their contact regions () are opposite one another. A contact-connection device () forms a short electrical connection between the two contact regions (). The contact regions () are connected to external contact regions () of the apparatus via a rewiring ().

Semiconductor apparatus having stacked semiconductor components

A method for producing chip packages is disclosed. In one embodiment, a plurality of chips is provided. The chips each have first pads. Second connection pads are applied on the wafer, wherein each second pad is electrically connected to a first pad.

Method for producing chip packages, and chip package produced in this way

An electronic component includes a semiconductor chip with an active front face and a passive rear face, with contact connections and contact surfaces respectively being provided on the active front face and/or on the passive rear face, and with conductive connections being provided in the form of structured conductive tracks for providing an electrical connection from the active front face to the passive rear face. An electronic assembly formed of stacked semiconductor chips, and a method for producing the electronic component and the electronic assembly are also provided.

Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly

An electronic device or devices and method for producing a device is disclosed. One embodiment provides an integrated component, a first package body and a contact device. The contact device penetrates the package body.

Electronic device and method for producing a device

Growing community of inventors

Germering, Germany

Harry Hedler