Alcatel Network Systems, Inc.

Rockwell International Corporation

Harry B Bonham, Jr

Andrew J Moore

David L Ma

Robert L Bontz

Richard E Lucas, Jr

Bryan K Douglas

Charles R Pratt, Iii

A method and system for forming microlens (78) on an optical fiber (60) include optical fiber lensing device (10) having lowering mechanism (18) for inserting optical fiber (60) at a predetermined and controlled speed to a predetermined depth in oil-acid bath having oil layer (62), acid layer (64), and boundary (68) between oil layer (62) and acid layer (64). The next step is to etch optical fiber (60) at boundary (68) by forming meniscus (66) around optical fiber (60) to selectively and controllably form on optical fiber (60) a microlens (78) having a predetermined shape, preferably a hyperbolic shape. The etching includes the steps of first tapering optical fiber (60) to a shape determined by the distance that optical fiber (60) is first inserted into acid layer (64). The etch step further chemically mills microlens (78) on optical fiber (60) to the predetermined shape by controlling the etch time and position of optical fiber (60) relative to boundary (68) for etching optical fiber (60) at boundary (68).

Method and system for forming an optical fiber microlens

A method of increasing the attachment bond strength between a first and second object comprising respective first and second materials is disclosed. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIGS. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIGS. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat. Finally, the first and second materials are brought to the operational temperature, wherein at least one of the first and second materials is placed in a compressive state at the contact point due to the relative change in size of at least one of the first and second materials as compared with the change in size of the other of the first and second materials.

Fiber optic assembly

In one embodiment, the present invention includes a method of increasing the attachment bond strength between a first and second object comprising respective first and second materials. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIG. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIG. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat. Finally, the first and second materials are brought to the operational temperature, wherein at least one of the first and second materials is placed in a compressive state at the contact point due to the relative change in size of at least one of the first and second materials as compared with the change in size of the other of the first and second materials. In a second and third embodiment, the present invention pertains to a method of sealing an end of a sleeve having an axial channel and a fiber extending through the axial channel and outward from the sleeve end.

Method for bonding a fiber to a sleeve for fiber optic packaging

Multi-chip module (MCM) (10) includes package body (12) having cavity (20) for accepting a plurality of devices and substrates and seal ring (26) to ensure the integrity of the package. Lead frame (18) having a plurality of individual leads (28) is coupled to the package body (12). Plurality of test points (38) or test pins (30) are located on the external surface of package body (12). A plurality of bond pads are located in cavity (20), including a first set or tier and a second set or tier of bond pads for electrically coupling the devices and substrates in the cavity (20) external to package body (12). The first set or tier of bond pads provides electrical connection between the individual devices in MCM (10) to plurality of test points (38) or test pins (30), and the second set or tier of bond pads provides electrical connection between the individual devices in MCM (10) and plurality of individual leads (28).

Method and apparatus for providing electrical access to devices in a

The invention disclosed includes both a method and apparatus for affixing an optic fiber tip in position with respect to a fiber communications circuit. In one embodiment of the method, a glass positioning member is located proximate the tip of the optic fiber. In another step, the glass positioning member is affixed to the fiber at a first position with respect to the fiber tip. The glass positioning member is also affixed in a second position with respect to the carrier. In a more detailed embodiment, the method of the present invention includes positioning the optic fiber through a channel of the glass positioning member. Heat is applied to the glass positioning member causing it to soften such that its channel collapses around and fuses to the fiber. In still further detail, the fused positioning member/fiber are affixed to a block, and the block is fused to a carrier. Alignment steps are taken during the fusing steps to locate the tip of the fiber in the desired position relative to the fiber communications circuitry.

Method and apparatus for affixing an optic fiber tip in position with

An automatic wire bonder for bonding at least one wire between a first predetermined location on a workpiece and a second predetermined location on a substrate on which the workpiece is carried includes a wire feeding head, and means for moving the head, in x, y, and z directions, relative to the workpiece, x and y being at least parallel to the plane of the workpiece and z being an elevation direction above the workpiece. Means are included for determining a z direction measurement between the first and second predetermined locations. The bonder is computer controlled to automatically dispense the wire and to configure it to a predetermined configuration to include a partially circular portion and an adjacent straight portion to be bonded between the first and second predetermined locations. The shape of the partially circular portion and the length of the straight portion are automatically determined by at least the z direction measurement.

Growing community of inventors

Plano, TX, United States of America

Harry B Bonham, Jr