St-ericsson Sa

Harro Koning

Sjoerd Martijn Herder

An integrated circuit chip is disclosed having a semiconductor substrate and a plurality of conduction layers (metalz, metalz+1), disposed on the semiconductor substrate and separated by dielectric layers, for distribution of power and electrical signals on the chip. The integrated circuit chip comprises a power-supply distribution network () which comprises, in a first one (metalz) of the conduction layers, a first mesh structure () of electrically conductive material for distribution of a first electrical potential (POWER) of the power supply. The power-supply distribution network also comprises, in a second one (metalz+1) of the conduction layers, different from the first one of the conduction layers, a second mesh structure () of electrically conductive material for distribution of a second electrical potential (GROUND) of the power supply. In the first one (metalz) of the conduction layers, a first plurality of islands () of electrically conductive material is provided, each island being located in a hole () of the first mesh structure () and being electrically insulated from the first mesh structure with a dielectric material.

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Arnhem, Netherlands

Harro Koning