Nexperia B.v.

Harrie Martinus Maria Horstink

Gijs Jan De Raad

Pompeo V Umali

Chi Ho Leung

Shun Tik Yeung

Kan Wae Lam

Sven Walczyk

Suzana Domingues

Thierry Jans

An electrostatic discharge protection device and a method of making the same. The device includes a device area located on a semiconductor substrate. The device also includes an array of coextensive, laterally spaced fingers located within the device area. Each finger includes an elongate source and an elongate drain separated by an elongate gate. The fingers are electrically connected in parallel for conducting an electrostatic discharge current during an electrostatic discharge event. The device further includes a plurality of body contact regions. A layout of the body contact regions is graded such that a greater number of the body contact regions, larger body contact regions, or both are located towards a periphery of the device area than towards a central part of the device area. The layout of the body contact regions may encourage triggering of the electrostatic discharge protection device within the central part of the device area.

Electrostatic discharge protection device

A semiconductor die has internal circuitry formed on two more internal layers, and die bonding pads arranged on a top surface of the die. The bonding pads are connected to the internal circuitry for providing input and output signals to the internal circuitry. One or more connecting lines electrically connect one or more pairs of the die bonding pads, thereby defining a bonding pad layout. The die bonding pads are arranged and connected with the connecting lines such that the bonding pad layout is reversible, which allows the die to be used in different package types (e.g., TSSOP or DFN) yet maintain a standardized pin arrangement without the necessity for long or crossed bond wires.

Reversible semiconductor die

Growing community of inventors

Nijmegen, Netherlands

Harrie Martinus Maria Horstink