Light Labs Inc.

Digital Optics Corporation

Nan Chang O-film Optoelectronics Technology Ltd

Flextronics Ap, LLC

Flextronics International Usa, Inc.

Harpuneet Singh

James A Schmieder

Sapna A Shroff

Rajiv Laroia

Giles Humpston

Ellis Chau

Samuel Waising Tam

Dongkai Shangguan

Nitesh Shroff

Bhret Robert Graydon

Nicholas E Brathwaite

Nagilla Dikpal Reddy

Ocie Ward

Eddie Azuma

John Sasinowski

Peter Pietrangelo

Weiguang Si

Irmina Carpio

Guan Hock Yeow

Liqun Larry Wang

Tic Medina

Nghi Phan

Jiamin Bai

Bhret R Graydon

Methods and apparatus for implementing optical chains, e.g., camera modules, which can be used in a camera device are described as well as camera devices including multiple camera modules. In various embodiments one or more camera modules include mirror assemblies which support a movable mirror. The mirror is driven in some embodiments by a linear actuator, e.g., piezo electric actuator with the linear motion of the actuator's push rod being converted into angular mirror rotation by use of hinge, e.g., pivot on which the mirror is mounted. A return spring provide a force contrary to that provided by the actuator. A recess is included in a mounting board to allow the bottom of the mirror or a portion of the mirror mounting hinge to be placed below the surface of the mounting board to which the camera module is secured.

Camera device methods, apparatus and components

An exemplary camera calibration apparatus includes a movable, e.g., rotatable, support structure which is controllably positioned to allow for image capture of different test patterns and image capture of the same pattern at different distances by a mounted camera. A first test pattern is mounted on a wall, e.g., a pyramid shaped 4 sided wall formed by panels surrounding the camera under calibration. The movable support structure has a first mirror attached to a first side and has a second test pattern attached to a second side. A second mirror mounted on an internal sidewall of the calibration apparatus housing facilities a different image path distance between the camera capturing the image of the first test pattern and the first test pattern. The exemplary camera calibration apparatus is well suited for efficiently calibrating camera devices including a plurality of camera modules, e.g., optical chains, in a relatively small area.

Camera calibration apparatus and methods

Methods and apparatus, for mounting and using a filter over an image sensor are described as well as camera modules and apparatus incorporating the filter mount. Also described is a sensor and filter assembly which can be formed by combining the sensor, filter, filter mount, and a mounting board which can be shipped and integrated into a camera module and/or camera. A filter is placed in a filter well of a filter mount. By using a well to support the filter over a sensor, the top of the filter can be level or below the top of sidewalls of the filter mount. Use of a well to mount the filter reduces the risk of stray or unintentionally reflected light reaching the sensor and degrading captured images while protecting the filter from downward pressure or sideways contact.

Filter mounting methods and apparatus and related camera apparatus

Camera

A disclosed method of manufacturing a camera module includes providing an optical assembly, providing an integrated circuit image capture device (ICD), fixing the optical assembly directly to the ICD, then forming a housing directly over the optical assembly. The method further includes forming the housing over the ICD and the optical assembly via transfer molding. The method further includes forming solder balls on the rear surface of the ICD so as to enable the camera module to be reflow soldered to a host device. In an alternative embodiment of the present invention, the method includes providing a second ICD, providing a second optical assembly, providing a housing substrate, fixing the first optical assembly over the first ICD, fixing the second optical assembly over the second ICD, and forming the housing substrate over both the first and second optical assemblies. The alternative method further includes separating the housing substrate in to a first portion formed over the first optical assembly and second portion formed over the second optical assembly, providing a second housing substrate, and forming the second housing substrate over the first and second portions.

Wafer level camera module with molded housing and method of manufacturing

A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.

Attachment of wafer level optics

A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same

A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.

Wafer level camera module and method of manufacture

A disclosed method of manufacturing a camera module includes providing a stack of optical elements, providing an integrated circuit image capture device (ICD) having a top surface with an array of sensors, rigidly attaching the stack of optical elements to top surface of the image capture device, providing a substrate having an opening therethrough and a recess around said opening, and attaching the image capture device to the substrate such that edges of the image capture device are disposed in the recess and the stack of optical elements extends through the opening. The method further includes providing a second substrate (e.g., host PCB) and mounting the substrate on the second substrate to attach the camera module to the host device. Optionally, the substrate is mounted to the second substrate via a reflow solder process.

Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly

A low-cost wafer-level packaging (WLP) method for attaching glass to optical image-sensor devices on a semiconductor wafer in order to increase the yield of image-sensor modules during later steps of assembly. One embodiment relates to applications with image-sensors (and microlenses) fabricated on a wafer. A glass wafer is singulated, aligned to mirror the die pattern on an image-sensor wafer, and then bonded to the image-sensor wafer such that optical adhesive forms a layer between the each image-sensor and its glass cover. Another embodiment applies cavity walls to singulated glass covers, which are then attached to image sensors which may be formed on a single wafer. The wafer can then be singulated and a plurality of image sensor packages is formed.

Techniques for glass attachment in an image sensor package

A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e.g., by an adhesive) on the flexible circuit substrate. A stiffener (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e.g., a lens housing).

System and method for mounting an image capture device on a flexible substrate

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Dublin, CA, United States of America

Harpuneet Singh