Teradyne, Inc.

Other

Harold Wasserman

Gregg Eric Fuhriman

A system for inspecting potentially warped printed circuit board assemblies is disclosed. The system includes an inspection head with an axial, centrally located camera, and a laser disposed at an angle off the central axis. The central camera and the angled laser can be used during an initial scan of a printed circuit board assembly to measure and compensate for warp in the assembly, thereby making a subsequent inspection of the assembly more accurate.

Measuring and compensating for warp in the inspection of printed circuit board assemblies

An apparatus and method for inspecting a printed circuit board, whereby a list of windows encompassing respective regions of the printed circuit board are generated. The windows are then scanned, and data representing the respective regions is captured and stored. The captured data includes data relating to a plurality of pixels for each window. Next, data relating to a plurality of adjacent pixels is retrieved, and values of the adjacent pixels are summed. Finally, either the data relating to the plurality of adjacent pixels or the sum of adjacent pixel values is selected for use in subsequent processing. The apparatus and method is especially useful for determining an average brightness level for each window.

Apparatus and method for processing video data in automatic optical inspection

A method is available for inspecting a printed circuit board and solder paste deposited upon the printed circuit board, whereby both systematic defects occurring during a solder paste deposition process and random defects are located. The printed circuit board is continuously scanned by an inspection head immediately following the solder paste deposition process. Images of the printed circuit board are then analyzed for random defects such as missing solder paste, improper solder paste coverage, and solder bridging. Next, heights of solder paste deposits are sampled. A pattern of light is projected upon selected solder paste deposits, and images of the selected solder paste deposits are captured. Light triangulation techniques are then used for determining the height of each selected solder paste deposit. Variations in the height of solder paste are systematic defects occurring in the solder paste deposition process.

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Skillman, NJ, United States of America

Harold Wasserman