Nxp B.v.

Harold Roosen

Wim Van Den Einden

Jozef Thomas Martinus Van Beek

Gerhard Koops

Greja Johanna Adriana Maria Verheijden

Johannes Van Wingerden

Michael Antoine Armand In 't Zandt

Didem Ernur

A method of forming a MEMS device by encapsulating a MEMS element with a sacrificial layer portion deposited over a substrate arrangement, the portion defining a cavity for the MEMS element, forming at least one strip of a further sacrificial material extending outwardly from the portion, forming a cover layer portion over the sacrificial layer portion, the cover layer portion terminating on the at least one strip, removing the sacrificial layer portion and the at least one strip, the removal of the at least one strip defining at least one vent channel extending laterally underneath the cover layer portion and sealing the at least one vent channel. A device including such a packaged micro electro-mechanical structure.

MEMS device forming method and device with MEMS structure

A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed.

Microscopic structure packaging method and device with packaged microscopic structure

Growing community of inventors

Eindhoven, Netherlands

Harold Roosen