Hewlett-packard Development Company, L.p.

Nvidia Corporation

Baidu USA LLC

Network Appliance, Inc.

Harold Miyamura

Ali Heydari

Jeremy Rodriguez

Christopher Gregory Malone

David S Hishinuma

Richard W Davis

Tianyi Gao

Dustin C Rosing

David J Baik

David J Willheim

Ken G Robertson

Michael Leslie Wortman

Marc F Moisson

Kenneth G Robertson

Brad A Reger

Salvatore Bondi

Junichi Kato

George T Feltovich

Alexander Toichi Ishii

Rong-Che Chen

Alex R Naderi

Mike Sabotta

Jorge E Rocabado

Uschas Chowdhury

A system comprising an adapter plate to couple a plurality of different types of cooling manifolds to one or more racks in a datacenter is disclosed. Additionally, a system comprising an adapter plate to adaptively couple a cooling manifold to a plurality of different types of server racks is disclosed.

Fastening systems for manifolds of datacenter racks

A redundancy shut-off system for a datacenter liquid cooling system is disclosed. The redundancy shut-off system has a first ball valve located above a datacenter platform and coupling between a row manifold of a secondary cooling loop and a rack manifold of a rack, where the first ball valve provides redundancy to a second ball valve located below the datacenter platform.

Redundant isolation of rack manifolds for datacenter cooling systems

A remediation system for threshold leaks in a datacenter liquid cooling system is disclosed. The system includes a fluid controller and a power controller that are adapted to receive input from a learning subsystem that can determine that a threshold leak has occurred even though a computing component is functioning normally, so that a change in power state to reduce reliance on the coolant and so that a change of flow of the coolant may be effected.

Intelligent threshold leak remediaton of datacenter cooling systems

Systems and methods for evaluating cooling characteristics are disclosed. In at least one embodiment, a thermal test vehicle can be used to simulate a thermal performance of a computing unit.

Thermal test vehicle

An adapter plate and a fastening system for fastening a manifold to a rack in a datacenter is disclosed. The adapter plate is associated with the manifold and has holes to receive buttons in configurable positions. The configurable positions enable the buttons to mate with keyholes of a bracket of the rack in order to fasten the manifold to the bracket.

A liquid immersion cooling system can include a tank having an upward facing opening at a top portion of the tank. A mounting mechanism fixes one or more electronic components to an interior of the tank. A bus bar assembly is located at the top portion of the tank, the bus bar assembly having a shield that covers one or more bus bars of the bus bar assembly from above. Power terminals of each of the one or more electronic components engage with the one or more bus bars of the bus bar assembly from below.

Immersion cooling system with top mounted bus bar

A liquid immersion cooling systems can include an immersion tank for housing cooling liquid, and a carrier tray. The carrier tray can include a mounting mechanism to attach one or more electronic components to the carrier tray, one or more handles, and one or more extendable sliders, each having a first connection to the carrier tray and a second connection to the immersion tank. The immersion tank can have an opening that faces upward. In a first position of the one or more extendable sliders, the carrier tray is within the immersion tank, and in a second position of the one or more extendable sliders, the carrier tray is vertically lifted out of the opening of the immersion tank.

Carrier safety device for heavy equipment in an immersion cooling system

A system of keying implementation for swapping paired devices is provided. The system includes a controller module having a first keying member, a power supply unit having a second keying member, and a chassis having a plurality of receiving slots for receiving the controller module and the power supply unit. When the controller module and the power supply unit are a matched pair and when the controller module and the power supply unit are fully inserted, next to each other, into the plurality of receiving slots, the first keying member and the second keying member do not interfere with each other so that the power supply unit may supply power to the controller module.

Keying implementation for swapping paired devices

In one embodiment, there is shown a system and method of allowing a user to gain access to information pertaining to certain equipment by pulling a label out of an opening in a surface of the equipment, viewing information on the label; and pushing the label back into the opening. In a further embodiment, the label is captive to the equipment independent from a bezel surrounding the equipment. In a still further embodiment of the invention, the label has on it pre-established information pertaining to the equipment, as well as user added information.

System and method for providing access to equipment identity information

A computing device module for receipt within a computing device chassis includes an enclosure and a handle movably coupled to the enclosure. The handle moves between an extended position and a retracted position. The handle includes at least one opening configured to permit at least one hand digit to extend through the at least one opening when the handle is in the retracted position.

Computing device module

The present invention is an apparatus for supporting the dense integration of a plurality of multi-drive modules. A chassis assembly of the present invention may house a plurality of multi-drive modules whereby each multi-drive module may house multiple drives. Each multi-drive module may be easily removed from the chassis for reduced serviceability time. Each drive may be housed within a carrier assembly, the carrier assembly being easily removed from the multi-drive module of the present invention. Advantageously, a dense integration of drives may be achieved while providing proper ventilation and vibration dampening.

High density drive chassis assembly

Bezel for rack-mounted device

A heat sink comprises a base having a substantially flat region for interfacing with an electronic component, and at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region substantially perpendicular to the flat region of the base. By providing a heat pipe in a heat sink that is L-shaped or U-shaped, a greater portion of the heat pipe is in contact with the heat-generating electronic component. As a result, thermal efficiency increases because there is more direct contact with the heat pipe.

Heat sink with angled heat pipe

A heat sink includes a heat pipe and a base adapted to allow the heat pipe to directly contact a component. By directly contacting the component, thermal efficiency is increased. Furthermore, increasing the surface area of the heat pipe that is in direct contact with the component also increases thermal efficiency.

Heat sink with heat pipe in direct contact with component

An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.

Growing community of inventors

San Jose, CA, United States of America

Harold Miyamura