Palo Alto Research Center Inc.

Xerox Corporation

Solfocus, Inc.

Harold Ackler

David Kirtland Fork

David G Duff

John Stuart Fitch

Scott Eugene Solberg

Michael C Weisberg

Hing Wah Chan

Linda T Romano

Hing-Wah Chan

A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.

Metal trace fabrication for optical element

Methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure before release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is used to form a spring metal finger from these layers. A second mask defines a window exposing a tip of the finger. The release layer under the tip is etched through the window, and then a passive-conductive coating material (which may also have spring characteristics) is deposited on the tip. The second mask and residual coating material are then lifted off, and a third (release) mask is formed that is used to release a free end of the spring metal finger. The release mask is then stripped. When the passive-conductive coating includes spring characteristics, the stress variations of the coating help to lift the free end if the finger during release.

Method for fabricating a spring structure

Growing community of inventors

Boise, ID, United States of America

Harold Ackler