Motorola Corporation

Harold A Downey

James W Miller

Scott K Pozder

Thomas Sachio Kobayashi

Susan H Downey

Alan H Woosley

Everitt W Mace

An integrated circuit die includes an input/output (I/O) cell. The I/O cell includes active I/O circuitry in a substrate, a plurality of metal interconnect layers, an insulating layer, a first pad, and a second pad. The plurality of metal interconnect layers are formed over the substrate. The insulating layer is formed over the plurality of metal interconnect layers. The second pad is formed over the insulating layer and positioned directly over at least two metal structures in a final metal layer of the plurality of interconnect layers. The pad is selectively coupled to one of at least two metal structures by at least one opening in the insulating layer.

Integrated circuit die I/O cells

In a semiconductor device, a method forms an alternative ground contact for a semiconductor die in which bulk silicon at the back of a die may be electrically grounded to an area containing functional devices and/or to packaging substrate by conductive fillet material surrounding the die and in contact with the bulk silicon and with a guard ring surrounding the area containing functional devices and/or the packaging substrate.

Method of forming an alternative ground contact for a semiconductor die

A method of packaging a semiconductor device includes providing a chase (11) with a cavity (12). The cavity (12) has a cavity sidewall (13). A substrate (19) is provided having a substrate sidewall (20) wherein the substrate (19) is positioned in the cavity (12). A space or gap (21) is formed between the substrate sidewall (20) and the cavity sidewall (13). To insulate the gap (21) from mold compound (27), a barrier layer (22) is placed adjacent to the chase (11) and adjacent to the substrate (19) wherein the barrier layer (22) overlays a portion of the space or gap (21). Mold compound (27) is injected over the barrier layer (22), over the portion of the space or gap (21), and toward the substrate (19). The barrier layer (22) is used to prohibit the mold compound (27) from contacting the substrate sidewall (20) and the cavity sidewall (13) when the substrate (19) is being encapsulated.

Growing community of inventors

Austin, TX, United States of America

Harold A Downey