Applied Materials, Inc.

Harisha Sathyanarayana

Edwin C Suarez

Abhishek Chowdhury

Nataraj Bhaskar Rao

Siqing Lu

Mohammad Kamruzzaman Chowdhury

Arun Chakravarthy Chakravarthy

Diego Ramiro Puente Sotomayor

Qanit Takmeel

Deposition ring of a process kit for semiconductor substrate processing

Grounding ring of a process kit for semiconductor substrate processing

Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a deposition ring including a first portion having an first inner ledge and a second portion having a second inner ledge, wherein in a first position, the first portion is spaced from the second portion, and wherein in a second position, the second portion is configured to engage the first portion so that the first inner ledge is aligned with the second inner ledge along a common plane to form a clamping surface.

Deposition ring for thin substrate handling via edge clamping

Cover ring for use in semiconductor processing chamber

Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a cover ring for use in a process chamber includes: an annular body that includes an upper surface and a lower surface, an inner lip extending radially inward and downward from the annular body, and a plurality of protrusions extending downward from the inner lip and disposed at regular intervals along the inner lip, wherein lowermost surfaces of the plurality of protrusions together define a planar substrate contact surface.

Thin substrate handling via edge clamping

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Bengaluru, India

Harisha Sathyanarayana