Advanced Micro Devices Corporation

Gtat Corporation

Twin Creeks Technologies, Inc.

Harish Kumar Bolla

Steven M Zuniga

Andrew J Nagengast

Aditya Agarwal

Derek G Aqui

Keenan Leon Guerrero

Bhanwar Singh

Iraj Emami

Jason Phillip Cain

A system for simultaneously treating multiple workpieces is configured with sites, configured to hold respective workpieces, affixed on a rotatable base. Each site has a shelf accommodating an interior space and may be positioned by base rotation in alignment with a station of fixed location. Each station is equipped with an active component. The active components are movable simultaneously within respective stations into the respective interior spaces of respective aligned sites.

Apparatus and method for simultaneous treatment of multiple workpieces

A system for simultaneously treating multiple workpieces is configured with treatment sites, configured to hold respective workpieces, fixed on a rotatable base. Treatment stations are equipped with respective active components operable simultaneously to treat respective workpieces identically on respective aligned treatment sites. For loading and unloading the treatment sites are rotated through distinct loading and unloading stations of the treatment stations which allow loading of a second batch while a first batch is being unloaded.

The disclosed embodiments reduce across-chip performance variation through non-contact electrical metrology. According to a feature is a process control system that includes a component that measures transistor electrical performance in a product wafer. Also included in the system is a mapping component that converts the transistor performance into exposure dose values and a process tool that communicates the exposure dose value to a scanner. The exposure dose value is fed back for optimization of future chip exposures. The disclosed embodiments directly optimize transistor performance, thus controlling an important parameter in many integrated circuits.

Scanner optimization for reduced across-chip performance variation through non-contact electrical metrology

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Sunnyvale, CA, United States of America

Harish Kumar Bolla