Intel Corporation

Harish Jagadish

David Pidwerbecki

Arvind S

Samantha Rao

Madhukar Patil

Prakash Kurma Raju

Prasanna Pichumani

Bijendra Singh

Anand Reddy

Raghavendra Doddi

Gopinath Kandasamy

Babu Triplicane Gopikrishnan

Guru Prakash

Mark Angus MacDonald

Jeff Ku

Paul J Gwin

Arvind Sundaram

Jered H Wikander

Gavin Sung

Krishnakumar Varadarajan

Shawn S Mceuen

Tim Liu

Gokul V Subramaniam

Jason Y Jiang

Ivan By Wang

Gerry Juan

James Panakkal

Narasimha Shastri

Sammi Wy Liu

Busbar

There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

Thermal dissipation in dual-chassis devices

Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.

Hybrid thermal cooling system

Embodiments are generally directed to a unified chassis construction for an all in one computer. An embodiment of a computer system includes a computer sub-system to provide computer operation; a display sub-system to provide display operation; a unified plate, components installed in the unified plate including at least one or more computer sub-system components and one or more display sub-system components; and a display screen coupled with the unified plate.

Unified chassis construction for all in one computer

Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein the housing is comprised of at least two panels wherein at least one of the panels is formed from a porous material configured to allow air flow through the panel.

Cooling electronic devices

Techniques related to a hinge in a computing device are described herein. The techniques may include forming a shaft to move rotationally, and forming a sliding component to move translationally as a result of rotational movement of the shaft.

Rotational to translational locking hinge

Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.

Conformal coating including embedded thermal energy absorbing material

Multi-purpose grip for a portable computing device

Growing community of inventors

Bengaluru, India

Harish Jagadish