Advanced Micro Devices Corporation

Haris Fazelah

Tek Seng Tan

Keng Sang Cha

Ahmad Zahrain B Mohamad Shakir

In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.

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Penang, Malaysia

Haris Fazelah