Intel Corporation

Harinadh Potluri

Ravindranath Vithal Mahajan

Donald Tiendung Tran

Vladimir K Tamarkin

Srikant Nekkanty

Ling Liao

Andrew Alduino

David Hui

Suresh V Pothukuchi

Sushrutha Reddy Gujjula

David M Bond

Sushrutha Gujjula

David Bond

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Dual-sided co-packaged optics for high bandwidth networking applications

Growing community of inventors

Milpitas, CA, United States of America

Harinadh Potluri