Intel Corporation

General Electric Company

Hari Shanker Thakur

Prakash Kurma Raju

Juha Paavola

Arnab Sen

Kathiravan D

Jeff Ku

Mark Charles Carbone

Vivek Paranjape

Gavin Sung

Gustavo Fricke

Justin Michael Huttula

Lance Lin

Jason Y Jiang

Evan Piotr Kuklinski

Christopher M Moore

Gerry Juan

Ritu Bawa

Jeffrey Douglas Rambo

Prasanna Pichumani

Daniel J Ragland

Tim Liu

Hua Yang

Mikko Antero Makinen

Kannan G Raja

Gokul V Subramaniam

Arvind Namadevan

Baomin Liu

Xiyong Tian

Jia Yan Go

Ruander Cardenas

Twan Sing Loo

Columbia Mishra

Babu Triplicane Gopikrishnan

Chin Kung Goh

Javed Shaikh

Nehakausar Shaikh Ramjan Pinjari

Deepak Sekar

Siddhartha Pal

George Baoci Sun

Shih Wei Nien

Chun-Ting Liu

Cora Nien

Wan Yu Liu

Penchala Pratap Binni Boyina

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.

Heat pipe with in-plane heat spreader and loading mechanism

There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension dof the rectangular form factor is at least approximately twice a first dimension dof the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second dedges of the planar vapor chamber, further disposed to conduct heat from the first and second dedges to the first and second fan respectively.

Vapor chambers

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

Vapor chamber and means of attachment

An ejector assembly includes a primary nozzle in fluid communication with a primary fluid inlet, a secondary nozzle in fluid communication with a secondary fluid inlet, the primary nozzle being oriented concentrically within the secondary nozzle and the secondary nozzle having a venturi downstream of the primary nozzle, and the primary nozzle having a variable cross-sectional area. A gas turbine engine includes a source of high pressure air, a region of low pressure air, and an ejector assembly, the ejector assembly includes a primary nozzle in fluid communication with a primary fluid inlet, the primary fluid inlet in fluid communication with the source of high pressure air, a secondary nozzle in fluid communication with a secondary fluid inlet, the secondary fluid inlet in fluid communication with the region of low pressure air, the primary nozzle being oriented concentrically within the secondary nozzle and the secondary nozzle having a venturi downstream of the primary nozzle, and the primary nozzle having a variable cross-sectional area.

Variable area ejector

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Bengaluru, India

Hari Shanker Thakur