Applied Materials, Inc.

Hari Prasath Rajendran

Kirankumar Neelasandra Savandaiah

Thomas B Brezoczky

Srinivasa Rao Yedla

Bhaskar Prasad

Nitin Bharadwaj Satyavolu

Lakshmikanth Krishnamurthy Shirahatti

Aspects of the disclosure provided herein generally provide a substrate processing system that includes: a processing chamber including: a top plate having an array of process station openings disposed therethrough surrounding a central axis, a bottom plate having a first central opening, and a plurality of side walls between the top plate and the bottom plate; a plurality of heaters disposed in the top plate and the bottom plate and configured in a plurality of regions; and a system controller configured to independently control the plurality of heaters in each region.

Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

In one example, an electrostatic chuck comprises a chuck body having a top surface configured to support a substrate and a bottom surface opposite the top surface. The chuck body comprises one or more chucking electrodes, and one or more heating elements. The chuck body further comprises first terminals disposed on the bottom surface of the chuck body and coupled with the one or more heating elements, second terminals disposed on the bottom surface of the chuck body and coupled with the one or more chucking electrodes, and third terminals disposed on the bottom first surface of the chuck body and coupled with the one or more chucking electrodes.

Electrostatic chuck having a heating and chucking capabilities

Growing community of inventors

Coimbatore, India

Hari Prasath Rajendran