Infineon Technologies Ag

Harald Wiedenhofer

Edward Fuergut

Werner Schustereder

Irmgard Escher-Poeppel

Paul Ganitzer

Joachim Hirschler

Gerhard Poeppel

Srinivasa Reddy Yeduru

Franz Kleinbichler

Stephanie Fassl

Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.

Method of reducing a sheet resistance in an electronic device, and an electronic device

In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.

Method of processing a semiconductor device and chip package

Growing community of inventors

Bad Abbach, Germany

Harald Wiedenhofer