International Business Machines Corporation

Harald W Gruber

Heinz G Horbach

Thomas Ludwig

Helmut Schettler

Frank Druschke

Gerhard Elsner

Ewald E Stadler

Gunther W Kotzle

Kurt Hinrichsmeyer

Rainer Kratzert

Roland Diemer

Reinhold Braun

Wolfgang Beck

Wolfgang Schmid

Production of a support element module for embedding into smart cards or

A module containing an electronic package provides a housing for cooling and protecting the electronic package. A top metal shell and a bottom metal shell form a common cavity in which the package is embedded without touching the inner walls of the cavity. A flexible thermally conductive foil is fixed to each of the shells. The foil is adjustable to the surface of the package and is isolated from electrically conductive parts of the package. A cooling liquid fills the gaps between the metal shells and the foils. Flexible isolated circuit means connect the package to the outside of the housing, balancing means balance pressure and volume between the shells, and further means firmly hold together the housing.

Module for electronic package

An electronic package (11) which comprises a substrate (12) having several chips (13) arranged thereon, and a plurality of connector pins (26) fitted in pin plates (21-24) and electrically connected via conductors to the chips (13). Each pin plate is mounted by means of at least one flexible connector element (29) connected to the conductors at a respective peripheral section (16-19) of the substrate (12). The pin plates have a base surface in the form of any discretionary polygon, in such a manner that, when folded, form a plane substantially flush with the plane of the substrate (12) into a position beneath the substrate (12), or vice versa. Thus an electronic package is obtained which is less complex in its manufacture and covers a considerably reduced base surface while offering a comparable performance.

Electronic package

Growing community of inventors

Herrenberg, Germany

Harald W Gruber